Methods of forming polycrystalline diamond cutters

Abstract

A method for forming a cutting element that includes forming at least one cavity in at least one surface of a polycrystalline abrasive body; placing the polycrystalline abrasive body adjacent a substrate such that an opening of at least one cavity is adjacent the substrate at an interface, wherein an interface surface of the substrate is non-mating with the polycrystalline abrasive body; and subjecting the polycrystalline abrasive body and substrate to high pressure/high temperature conditions is disclosed.

1 . A method for forming a cutting element, comprising:
 forming at least one cavity in at least one surface of a polycrystalline abrasive body;   placing the polycrystalline abrasive body adjacent a substrate such that an opening of at least one cavity is adjacent the substrate at an interface, wherein an interface surface of the substrate is non-mating with the polycrystalline abrasive body; and   subjecting the polycrystalline abrasive body and substrate to high pressure/high temperature conditions.   
   
   
       2 . The method of  claim 1 , wherein the polycrystalline abrasive body comprises at least one of polycrystalline diamond, polycrystalline diamond having at least a portion of catalyzing material removed therefrom, or polycrystalline cubic boron nitride. 
   
   
       3 . The method of  claim 2 , wherein the portion of catalyzing material is removed before the forming. 
   
   
       4 . The method of  claim 2 , wherein the portion of catalyzing material is removed after the forming. 
   
   
       5 . The method of  claim 1 , further comprising:
 adding an intermediate material in at least a portion of the at least one cavity.   
   
   
       6 . The method of  claim 5 , wherein the intermediate material comprises at least one of tungsten, tungsten carbide, or diamond powder. 
   
   
       7 . The method of  claim 1 , wherein the opening of the at least one cavity is less than 3 mm in diameter. 
   
   
       8 . The method of  claim 7 , wherein the opening of the at least one cavity is less than 1 mm in diameter. 
   
   
       9 . The method of  claim 8 , wherein the opening of the at least one cavity is less than 50 microns in diameter. 
   
   
       10 . The method of  claim 1 , wherein prior to placement adjacent the polycrystalline abrasive body, an upper surface of the substrate is substantially planar. 
   
   
       11 . The method of  claim 1 , wherein prior to placement adjacent the polycrystalline abrasive body, an upper surface of the substrate is non-planar. 
   
   
       12 . A method for forming a cutting element, comprising:
 forming a polycrystalline diamond compact of a polycrystalline diamond body attached to a substrate comprising:
 placing a mixture of diamond particles and a catalyst material adjacent a substrate; and 
 subjecting the mixture and substrate to high-pressure/high temperature conditions; 
   detaching the polycrystalline diamond body from the substrate;   forming at least one cavity in at least one surface of the detached polycrystalline diamond body;   placing the polycrystalline abrasive body adjacent a substrate material such that an opening of at least one cavity is adjacent the substrate material; and   subjecting the polycrystalline abrasive body and substrate material to high temperature/high pressure conditions.   
   
   
       13 . The method of  claim 12 , further comprising:
 removing at least a portion of the catalyst material from the polycrystalline diamond body.   
   
   
       14 . The method of  claim 12 , further comprising:
 filling at least a portion of the at least one cavity with an intermediate material.   
   
   
       15 . The method of  claim 14 , wherein the intermediate material comprises at least one of tungsten, tungsten carbide, or diamond powder. 
   
   
       16 . The method of  claim 12 , wherein the opening of the at least one cavity is less than 3 mm in diameter. 
   
   
       17 . The method of  claim 16 , wherein the opening of the at least one cavity is less than 1 mm in diameter. 
   
   
       18 . A method for forming a cutting element, comprising:
 forming at least one cavity in at least one surface of a polycrystalline abrasive body;   placing the polycrystalline abrasive body adjacent a substrate precursor material such that an opening of at least one cavity is adjacent the substrate precursor; and   subjecting the polycrystalline abrasive body and substrate precursor materials to high pressure/high temperature conditions.   
   
   
       19 . The method of  claim 18 , wherein the substrate precursor materials comprise a mixture of tungsten carbide powder and a Group VIII metal. 
   
   
       20 . The method of  claim 18 , further comprising:
 contacting the polycrystalline abrasive body with a leaching agent.   
   
   
       21 . The method of  claim 18 , wherein the opening of the at least one cavity is less than 3 mm in diameter. 
   
   
       22 . The method of  claim 21 , wherein the opening of the at least one cavity is less than 1 mm in diameter. 
   
   
       23 . A cutting element, comprising:
 a polycrystalline abrasive body; and   a substrate attached to the polycrystalline abrasive body,   wherein the polycrystalline abrasive body comprises, at the interface between the polycrystalline abrasive body and the substrate, at least one cavity formed therein, the at least one cavity having an opening with at least one dimension of less than 1 mm; and   wherein the substrate comprises at least one projection mating the at least one cavity.   
   
   
       24 . The cutting element of  claim 23 , wherein the wherein the polycrystalline abrasive body comprises at least one of polycrystalline diamond, polycrystalline diamond having at least a portion of catalyzing material removed therefrom, and polycrystalline cubic boron nitride. 
   
   
       25 . The cutting element of  claim 23 , wherein the cavity comprises a channel extending through an entire thickness of the polycrystalline abrasive body. 
   
   
       26 . The cutting element of  claim 23 , wherein the cavity extends a partial thickness into the polycrystalline abrasive body. 
   
   
       27 . The cutting element of  claim 23 , wherein the opening has at least one dimension of less than 50 microns. 
   
   
       28 . A cutting element, comprising:
 a polycrystalline abrasive body; and   a substrate attached to the polycrystalline abrasive body,   wherein the polycrystalline abrasive body comprises, at the interface between the polycrystalline abrasive body and the substrate, at least one cavity formed therein; and   wherein the substrate comprises at least one projection mating the at least one cavity, the at least one projection comprising a material composition distinct from the remaining substrate.   
   
   
       29 . The cutting element of  claim 28 , wherein the wherein the polycrystalline abrasive body comprises at least one of polycrystalline diamond, polycrystalline diamond having at least a portion of catalyzing material removed therefrom, and polycrystalline cubic boron nitride. 
   
   
       30 . The cutting element of  claim 28 , wherein the cavity comprises a channel extending through an entire thickness of the polycrystalline abrasive body. 
   
   
       31 . The cutting element of  claim 28 , wherein the cavity extends a partial thickness into the polycrystalline abrasive body. 
   
   
       32 . The cutting element of  claim 28 , wherein the opening has at least one dimension of less than 50 microns. 
   
   
       33 . The cutting element of  claim 28 , wherein the at least one projection comprises a binder content lower than the remaining substrate. 
   
   
       34 . The cutting element of  claim 28 , wherein the at least one projection comprises hard particles distinct from the remaining substrate. 
   
   
       35 . The cutting element of  claim 28 , wherein the at least one projection comprises a tungsten carbide and diamond composite.