US2010012286A1PendingUtilityA1

Method for forming a surface layer on a substrate

58
Assignee: SOONG TZU-WENPriority: Jan 14, 2008Filed: Aug 18, 2009Published: Jan 21, 2010
Est. expiryJan 14, 2028(~1.5 yrs left)· nominal 20-yr term from priority
Inventors:Tzu-Wen Soong
B29C 37/0032B22D 17/24B29C 70/78B29C 37/0067
58
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for forming a surface layer on a substrate is provided. First, a mold having a cavity is provided. Next, a surface layer is formed on at least a part of the surface of the mold within the cavity. After that, a molding step is performed.

Claims

exact text as granted — not AI-modified
1 . A method for forming a surface layer on a metallic substrate, comprising the steps of:
 providing a mold having a cavity therein;   forming a surface layer at least on a part of the mold within the cavity; and   molding the substrate.   
   
   
       2 - 15 . (canceled) 
   
   
       16 . The method according to  claim 1 , wherein the molding is injection molding. 
   
   
       17 . (canceled) 
   
   
       18 . The method according to  claim 1 , wherein the molding is metal casting. 
   
   
       19 . (canceled) 
   
   
       20 . The method according to  claim 1 , wherein the molding is die casting. 
   
   
       21 . (canceled) 
   
   
       22 . The method according to  claim 1 , wherein the metallic substrate comprises an aluminum-magnesium alloy, a titanium alloy, an aluminum alloy, a magnesium alloy, a zirconium alloy or a zinc alloy.

Join the waitlist — get patent alerts

Track US2010012286A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.