US2010006859A1PendingUtilityA1

Method of Manufacturing Substrates Having Improved Carrier Lifetimes

Assignee: CHUNG GILYONGPriority: Jul 19, 2006Filed: Jul 17, 2007Published: Jan 14, 2010
Est. expiryJul 19, 2026(expired)· nominal 20-yr term from priority
H10P 14/3444H10P 14/3442H10P 14/2926H10P 14/2904H10P 14/24H10P 14/3408C30B 25/02C30B 29/36C23C 16/325
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Claims

Abstract

This invention relates to a method for depositing silicon carbide material onto a substrate such that the resulting substrate has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a chlorosilane gas, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr. This invention also relates to a method for depositing silicon carbide material onto a substrate such that the resulting substrate has a carrier lifetime of 0.5-1000 microseconds, the method comprising a. introducing a gas mixture comprising a non-chlorinated silicon-containing gas, hydrogen chloride, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a substrate; and b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.; with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr.

Claims

exact text as granted — not AI-modified
1 . A method for depositing silicon carbide coating onto a substrate such that the resulting coating has a carrier lifetime of 0.5-1000 microseconds, the method comprising
 a. introducing a gas mixture comprising a chlorosilane gas, wherein the chlorosilane gas is dichlorosilane gas, methylhydrogendichlorosilane gas, dimethyldichlorosilane gas, or mixtures thereof, a carbon-containing gas, and hydrogen gas into a reaction chamber containing a single crystal silicon carbide substrate;   b. heating the substrate to a temperature of greater than 1000° C. but less than 2000° C.;   
     with the proviso that the pressure within the reaction chamber is maintained in the range of 0.1 to 760 torr. 
   
   
       2 . A method according to  claim 1  wherein the gas mixture further comprises a doping gas. 
   
   
       3 . A method according to  claim 2  wherein the doping gas is nitrogen gas, phosphine gas, or trimethylaluminum gas. 
   
   
       4 . (canceled) 
   
   
       5 . A method according to  claim 1 , wherein the carbon-containing gas has the formula H a C b Cl c , where a and b are greater than zero, and c is greater than or equal to zero. 
   
   
       6 . A method according to  claim 1  wherein the carbon-containing gas is C 3 H 8  gas, C 2 H 6  gas, CH 3 Cl gas, or CH 3 CH 2 CH 2 Cl gas. 
   
   
       7 . A product produced in accordance with the method of  claim 1 . 
   
   
       8 . (canceled) 
   
   
       9 . (canceled) 
   
   
       10 . (canceled) 
   
   
       11 . (canceled) 
   
   
       12 . (canceled) 
   
   
       13 . (canceled) 
   
   
       14 . (canceled) 
   
   
       15 . (canceled) 
   
   
       16 . (canceled) 
   
   
       17 . (canceled)

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