Cooling system

Abstract

A cooling system to cool an electronic component is disclosed. The cooling system includes a first connection to receive refrigerant, a region to transfer heat from an electronic component to the refrigerant from the first connection, at least one of a cooling coil, a cooling tube, or a cooling block positioned in the region and in fluid communication with the first connection, and a second connection to return refrigerant from the region to an evaporator.

1 . A cooling system to cool electronic components, the cooling system comprising:
 a first connection to receive refrigerant;   a region to transfer heat from an electronic component to the refrigerant from the first connection;   at least one of a cooling coil, a cooling tube, or a cooling block positioned in the region and in fluid communication with the first connection; and   a second connection to return refrigerant from the region to an evaporator.   
     
     
         2 . The cooling system of  claim 1 , wherein the region comprises the cooling coil. 
     
     
         3 . The cooling system of  claim 1 , wherein the region comprises the cooling tube. 
     
     
         4 . The cooling system of  claim 1 , wherein the region comprises the cooling block, the region being positioned within an enclosure of a variable speed drive. 
     
     
         5 . The cooling system of  claim 1 , wherein the region comprises the cooling block, the region being positioned adjacent to an enclosure of a variable speed drive. 
     
     
         6 . The cooling system of  claim 1 , wherein the electronic component is an electrical switching component of a variable speed drive. 
     
     
         7 . The cooling system of  claim 1 , further comprising a variable speed drive, the variable speed drive comprising the electronic component and an enclosure. 
     
     
         8 . The cooling system of  claim 7 , further comprising insulation positioned between the enclosure and the evaporator, the insulation being configured to prevent, reduce, or eliminate conduction between the enclosure and the evaporator. 
     
     
         9 . The cooling system of  claim 7 , further comprising a moisture drain positioned between the enclosure and the evaporator, the moisture drain being configured to drain condensed moisture from the enclosure. 
     
     
         10 . The cooling system of  claim 7 , further comprising at least one gap in the enclosure. 
     
     
         11 . A cooling system to cool an electronic component, the cooling system comprising:
 a first connection to receive a liquid refrigerant via a supply line;   a region to transfer heat from the electronic component to the refrigerant from the first connection;   a cooling coil positioned in the region and in fluid communication with the first connection;   a second connection to return vapor refrigerant from the region to an evaporator via a return line;   the cooling coil being positioned to transfer heat from the electronic component to the liquid refrigerant, the liquid refrigerant being supplied from within the evaporator by the supply line;   the cooling coil further being positioned to phase change the liquid refrigerant into the vapor refrigerant; and   the cooling coil further being positioned to supply the vapor refrigerant to the return line; and,   wherein the heat transferred from the electronic component cools the electronic component.   
     
     
         12 . The cooling system of  claim 11 , wherein the electronic component is an electrical switching component. 
     
     
         13 . The cooling system of  claim 11 , further comprising a variable speed drive, the variable speed drive comprising the electronic component and the enclosure. 
     
     
         14 . The cooling system of  claim 13 , further comprising at least one gap in the enclosure configured to prevent, reduce, or eliminate moisture condensation. 
     
     
         15 . A cooling system to cool an electronic component, the cooling system comprising:
 a first connection to receive a liquid refrigerant via a supply line;   a region to transfer heat from the electronic component to the refrigerant from the first connection;   at least one cooling tube or at least one cooling block positioned in the region and in fluid communication with the first connection;   a second connection to return vapor refrigerant from the region to an evaporator via a return line;   the at least one cooling tube or the at least one cooling block being positioned to transfer heat from the electronic component to the liquid refrigerant, the liquid refrigerant being supplied from within the evaporator by the supply line;   the at least one cooling tube or the at least one cooling block further being positioned to phase change the liquid refrigerant into the vapor refrigerant; and   the at least one cooling tube or the at least one cooling block further being positioned to supply the vapor refrigerant to the return line; and,   wherein the heat transferred from the electronic component cools the electronic component.   
     
     
         16 . The cooling system of  claim 15 , comprising the at least one cooling block, the at least one cooling block being disposed within the enclosure. 
     
     
         17 . The cooling system of  claim 15 , comprising the at least one cooling block, the at least one cooling block being disposed adjacent to the enclosure. 
     
     
         18 . The cooling system of  claim 15 , wherein the electronic component is an electrical switching component. 
     
     
         19 . The cooling system of  claim 15 , further comprising insulation positioned between the enclosure and the evaporator, the insulation being configured to prevent, reduce, or eliminate conduction between the enclosure and the evaporator. 
     
     
         20 . The cooling system of  claim 15 , further comprising a moisture drain positioned between the enclosure and the evaporator, the moisture drain being configured to drain condensed moisture from the enclosure.