Heat sink

Abstract

A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.

1 . A heat sink comprising:
 a base plate connected to a heat generator; and   at least one elastic plate to dissipate a heat generated from the heat generator, the elastic plate including an end portion connected to the base plate, and the elastic plate having a zigzag structure.   
   
   
       2 . The heat sink of  claim 1 , the hear generator includes at least one semiconductor chip. 
   
   
       3 . The heat sink of  claim 1 , wherein two elastic plates are connected to end portions of the base plate, respectively. 
   
   
       4 . The heat sink of  claim 1 , further comprising:
 at least one supporting plate for connecting an end portion of the elastic plate to the base plate.   
   
   
       5 . The heat sink of  claim 1 , wherein the elastic plate includes a bent portion having an angulated shape or a round shape. 
   
   
       6 . The heat sink of  claim 1 , further comprising:
 at least one incision groove between adjacent elastic plates.   
   
   
       7 . The heat sink of  claim 1 , further comprising:
 a fixing member for fixing the elastic plate to the heat generator.   
   
   
       8 . The heat sink of  claim 7 , wherein the fixing member includes at least one clip or at least one adhesion layer. 
   
   
       9 - 17 . (canceled) 
   
   
       18 . A heat sink comprising:
 a base plate connected to a semiconductor chip; and   one or more elastic plates extended from the base plate, having a zigzag structure between end portions of the base plate to dissipate a heat generated from the semiconductor chip, and having elasticity in and between the plates to reduce a force exerted on the elastic plates.   
   
   
       19 . The heat sink of  claim 18 , further comprising:
 one or more second elastic plates extending from the base plate and having a zigzag structure between second end portions of the base plate to dissipate a heat generated from the semiconductor chip, and having elasticity in and between the plates to reduce a force exerted on the elastic plates,   wherein one of the one or more elastic plates is connected to one of the end portions of the base plate, one of the one or more elastic plates is connected to one of the second end portions of the base plate, and the one or more elastic plates and the one or more second elastic plates are spaced apart by a gap formed between the other one of the end portions and the other one of the second end portions of the base plate.   
   
   
       20 . The heat sink of  claim 18 , wherein:
 the one or more elastic plates comprises a first elastic plate connected to one of the end portions of the base plate and disposed toward the other one of the end portions of the base plate, a second elastic plate extended from the first elastic plate at an angle with the first elastic plate and disposed toward the one of the end portions of the base plate, and a third elastic plate extended from the second elastic plate at another angle with the second elastic plate and disposed toward the other end of the end portions of the base plate; and   the first, the second, and the third elastic plates are disposed between the gap and the one of the end portions of the base plate.   
   
   
       21 - 22 . (canceled)