Recess-protrusion structure body, process for producing the same, piezoelectric device, and ink jet recording head

Abstract

In a step (A), a selectively removable resist layer or a selectively removable sacrifice layer is formed in a predetermined pattern in a protrusion non-forming region on a base plate. In a step (B), a pillar-shaped structure film is formed on a side of the base plate, on which side the resist layer or the sacrifice layer has been formed in the predetermined pattern. The pillar-shaped structure film contains a plurality of pillar-shaped bodies, each of which extends in a direction nonparallel with a base plate surface of the base plate. In a step (C), the resist layer or the sacrifice layer, and a region of the pillar-shaped structure film, which region is located on the resist layer or the sacrifice layer, are removed by use of a lift-off technique. At least one protruding region, which contains the pillar-shaped bodies, is thus formed.

1 . A process for producing a recess-protrusion structure body, which comprises a base plate and at least one protruding region having been formed on the base plate, the process comprising:
 i) a step (A) of forming a selectively removable resist layer or a selectively removable sacrifice layer in a predetermined pattern in a protrusion non-forming region on the base plate,   ii) a step (B) of forming a pillar-shaped structure film on a side of the base plate, on which side the resist layer or the sacrifice layer has been formed in the predetermined pattern, the pillar-shaped structure film containing a plurality of pillar-shaped bodies, each of which extends in a direction nonparallel with a base plate surface of the base plate, and   iii) a step (C) of removing the resist layer or the sacrifice layer, and a region of the pillar-shaped structure film, which region is located on the resist layer or the sacrifice layer, by use of a lift-off technique,   whereby the at least one protruding region, which contains the plurality of the pillar-shaped bodies, is formed.   
   
   
       2 . The process for producing a recess-protrusion structure body according to  claim 1 , wherein the resist layer or the sacrifice layer is formed in the predetermined pattern in the step (A) by use of a technique selected from the group consisting of a lift-off technique, a photolithography technique, and a transfer molding technique. 
   
   
       3 . The process for producing a recess-protrusion structure body according to  claim 1 , wherein the formation of the pillar-shaped structure film in the step (B) is performed under heating conditions. 
   
   
       4 . The process for producing a recess-protrusion structure body according to  claim 1 , wherein the sacrifice layer contains a carbon-containing compound and/or a carbon simple substance as a principal constituent, and is formed in the predetermined pattern.