Exposure apparatus and method for manufacturing device

Abstract

An exposure apparatus for exposing a shot region on a substrate includes a stage configured to hold and move the substrate, a projection optical system configured to project light onto the substrate, a measuring unit configured to measure a position of a partial region of a surface of the substrate, and a control unit configured to cause the measuring unit to measure the position with respect to each of a plurality of measurement points of each of a plurality of shot regions on the substrate, to determine a global shape of the surface based on the measured position, to calculate a correction value with respect to each of the plurality of measurement points based on the determined global shape, and to move the stage based on a measurement value corrected using the correction value corresponding to each of the plurality of measurement points.

1 . An exposure apparatus for exposing a shot region on a substrate, the exposure apparatus comprising:
 a stage configured to hold and move the substrate;   a projection optical system configured to project light onto the substrate;   a measuring unit configured to measure a position of a partial region of a surface of the substrate with respect to a direction of an optical axis of the projection optical system; and   a control unit configured to cause the measuring unit to measure the position with respect to each of a plurality of measurement points of each of a plurality of shot regions on the substrate, to determine a global shape of the surface based on the measured position, to calculate a correction value with respect to each of the plurality of measurement points based on the determined global shape, and to move the stage based on a measurement value corrected using the correction value corresponding to each of the plurality of measurement points,   wherein the control unit is configured to select a portion from the plurality of measurement points based on reproducibility of the measured position corresponding to each of the plurality of measurement points, and to calculate the correction value such that a weight for the measured position of the selected portion is greater than a weight for the measured position of each of the other measurement points.   
   
   
       2 . The exposure apparatus according to  claim 1 , wherein the measuring unit is configured to project light obliquely onto the surface of the substrate, to detect light reflected from the surface of the substrate, and to measure the position of the partial region based on a barycenter of the detected light. 
   
   
       3 . The exposure apparatus according to  claim 2 , wherein the control unit is configured to select the portion from the plurality of measurement points based on a quantity of the detected light with respect to each of the plurality of measurement points. 
   
   
       4 . The exposure apparatus according to  claim 3 , wherein the control unit is configured to select the portion from the plurality of measurement points based on a variation in the quantities of the detected light over the plurality of shot regions with respect to each of the plurality of measurement points. 
   
   
       5 . The exposure apparatus according to  claim 3 , wherein the control unit is configured to select the portion from the plurality of measurement points based on a change in the quantities of the detected light with respect to the plurality of measurement points. 
   
   
       6 . A method of manufacturing a device, the method comprising:
 exposing a substrate using an exposure apparatus according to  claim 1 ; and   developing the exposed substrate.