Processing system and method of operating a processing system

Abstract

A coating system comprises a swing station including a swing module and an arrangement of chambers. The arrangement of chambers comprises a lock chamber and a first coating chamber. The lock chamber is configured as a combined lock-in/lock-out chamber. The arrangement of chambers has a first substantially linear transport path indicated by dashed lines, and a second substantially linear transport path indicated by dashed lines. The arrangement of the paths establishes a dual track. The system includes a transport system for moving a substrate through the arrangement of chambers, along the first transport path and/or along the second transport path as indicated by arrows. One or particularly both chambers comprise transfer means for transferring the substrate/carrier from the first path to the second path by a lateral movement and/or from the second path to the first path.

1 . A processing system for processing a substrate, comprising:
 an arrangement of chambers including at least a first process chamber for depositing a first layer on said substrate;   at least a lock chamber configured for locking said substrate in said arrangement of chambers and/or locking a substrate out of said arrangement of chambers; and   a first substantially linear transport path for transporting said substrate from said lock chamber into said first process chamber;   wherein said processing system comprises a second substantially linear transport path for transporting said substrate from said first process chamber into said lock chamber;   wherein said second transport path is laterally offset relative to said first transport path.   
   
   
       2 . The processing system of  claim 1 ,
 wherein said arrangement of chambers comprises a second process chamber coupled in line with first said process chamber;   wherein said first substantially linear transport path extends from said first process chamber into said second process chamber for transporting said substrate from said first process chamber into said second process chamber or from said second process chamber into said first process chamber; and   said second substantially linear transport path extends from first process chamber into said second process chamber for transporting said substrate from said second process chamber into said first process chamber or from said first process chamber into said second process chamber.   
   
   
       3 . The processing system of  claim 1 ,
 wherein said arrangement of chambers comprises a transfer chamber coupled in line with said first process chamber and/or said second process chamber.   
   
   
       4 . The processing system of  claim 3 ,
 wherein said first substantially linear transport path extends from said second process chamber into said transfer chamber for transporting said substrate from said second process chamber into said transfer chamber or from said transfer chamber into said second process chamber; and   said second substantially linear transport path extends from said transfer chamber into said second process chamber for transporting said substrate from said transfer chamber into said second process chamber or from said second process chamber into said transfer chamber.   
   
   
       5 . The processing system of  claim 3 ,
 wherein said first substantially linear transport path extends from said first process chamber into said transfer chamber for transporting said substrate from said first process chamber into said transfer chamber or from said transfer chamber into said first process chamber, and   said second substantially linear transport path extends from said transfer chamber into said first process chamber for transporting said substrate from said transfer chamber into said first process chamber or from said first process chamber into said transfer chamber.   
   
   
       6 . The processing system of  claim 1 ,
 wherein said processing system comprises a transport system for transporting a substrate along said first transport path and along said second transport path.   
   
   
       7 . The processing system of  claim 6 ,
 wherein said transport system comprises at least a guidance for guiding a substrate along said first transport path and/or along said second transport path.   
   
   
       8 . The processing system of  claim 7 ,
 wherein said transport system comprises a first guidance for guiding said substrate along said first transport path and a second guidance for guiding said substrate along said second transport path.   
   
   
       9 . The processing system  claim 1 ,
 wherein at least one of said first process chamber, said second process chamber and said transfer chamber comprises means for transferring said substrate from said first transport path to said second transport path and/or from said second transport path to said first transport path.   
   
   
       10 . The processing system of  claim 9 ,
 wherein said means for transferring said substrate includes a transfer device for laterally displacing said substrate from said first transport path to said second transport path and/or from said second transport path to said first transport path.   
   
   
       11 . The processing system of  claim 10 ,
 wherein said means for transferring said substrate includes a transfer device for laterally displacing a section of said guidance from said first transport path to said second transport path and/or from said second transport path to said first transport path.   
   
   
       12 . The processing system of  claim 10 ,
 wherein said means for transferring said substrate includes a combination of at least a first guidance second and a second guidance section,   wherein said first guidance section is arranged parallel with said second guidance section in a distance corresponding to the distance between said first transport path and said second transport path, and a transfer device for laterally displacing said combination for moving a substrate from said first transport path to said second transport path and vice versa.   
   
   
       13 . The processing system of  claim 1 ,
 wherein said first process chamber and/or said second process chamber include processing tools arranged in said respective process chamber laterally besides said first transport path.   
   
   
       14 . The processing system of  claim 1 ,
 wherein said arrangement of chambers includes at least a third process chamber coupled in line with said first process chamber and/or the second process chamber.   
   
   
       15 . A method of operating a processing system according to  claim 1 , comprising the steps of:
 a) transporting a first substrate from said lock chamber into said first process chamber along said first transport path, and depositing a first layer on said first substrate;   b) laterally transferring said first substrate from said first transport path to said second transport path; and   c) transporting said first substrate into said lock chamber along said second transport path.   
   
   
       16 . The method of  claim 15 ,
 wherein said method comprises transporting a second substrate from said lock chamber into said first process chamber along said first transport path during said method step c.   
   
   
       17 . The method of  claim 15 ,
 wherein said method includes transferring said substrates being processed at least once from said first transport path to said second transport path in order to enable another substrate to pass the substrate along said first transport path.