Heat dissipation device

Abstract

A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly.

1 . A heat dissipation device comprising:
 a heat sink comprising a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively; and   a heat pipe comprising an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section, the third condenser section extending through the first fin assembly, the first condenser section interconnecting one of the second fin assemblies to the first fin assembly, and the second condenser section interconnecting the other second fin assembly to the first fin assembly.   
   
   
       2 . The heat dissipation device as described in  claim 1 , wherein the first condenser section, the evaporator section, the second condenser section and the third condenser section cooperatively from a rectangle, with an opening being formed between a free end of the third condenser section and the free end of the first condenser section. 
   
   
       3 . The heat dissipation device as described in  claim 1 , wherein the first fin assembly defines a through hole for the third condenser section of the heat pipe extending therethrough, the evaporator section thermally contacting with a bottom side of the first fin assembly. 
   
   
       4 . The heat dissipation device as described in  claim 3 , wherein each of the second assemblies defines a slot facing the first fin assembly, and the first condenser section and the second condenser section of the heat pipe are received in the slots of the second assemblies, respectively. 
   
   
       5 . The heat dissipation device as described in  claim 4 , wherein the first fin assembly comprises a plurality of first fins and a plurality of heat dissipation vanes each having a smaller size than each of the first fins, the heat dissipation vanes arranged on four corners of the first fin assembly to form four horny portions on the four corners correspondingly, two receiving rooms being defined in the two opposite side of the first fin assembly respectively, each of the receiving rooms being defined between two corresponding horny portions, the second assemblies being received in the receiving rooms respectively. 
   
   
       6 . The heat dissipation device as described in  claim 1 , further comprising another heat pipe having the same configuration with the heat pipe, the first fin assembly defining another through hole for a third condenser section of the another heat pipe extending therethrough, an evaporator section of the another heat pipe thermally contacting with the bottom side of the first fin assembly and be arranged side by side to the evaporator diction of the heat pipe. 
   
   
       7 . The heat dissipation device as described in  claim 6 , wherein each of the second assemblies defines a pair of slots facing the first fin assembly, the first condenser section of the heat pipe and a second condenser section of the another heat pipe are received in the pair of slots of one of the second assemblies, respectively, and the second condenser section of the heat pipe and a first condenser section of the another heat pipe are received in the pair of slots of the other one of the second assemblies, respectively. 
   
   
       8 . The heat dissipation device as described in  claim 7 , wherein each of the second assemblies comprises a base and a plurality of second fins extending outwardly from the base, the base comprising a plated portion and a pair of aliform portions extending upwardly and slantways from two opposite ends of the plated portion to make the base have a substantially V-shaped configuration, the slots being defined in one surface of the aliform portions of the base facing the first fin assembly. 
   
   
       9 . The heat dissipation device as described in  claim 7 , wherein the slots defined in each of the second fin assemblies are V-shaped. 
   
   
       10 . A heat dissipation device comprising:
 a heat sink comprising a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively; and   a heat pipe comprising an evaporator section and three condenser sections, the evaporator section and the three condenser sections cooperatively form a rectangle with an opening being formed between free ends of the heat pipe, one of the condenser sections interconnecting one of the second fin assemblies to the first fin assembly, one of the condenser sections interconnecting the other second fin assembly to the first fin assembly, and the one of the condenser sections extending through the first fin assembly.   
   
   
       11 . The heat dissipation device as described in  claim 10 , further comprising another heat pipe having the same configuration with the heat pipe, the first fin assembly defining two through holes for the two condenser sections of the heat pipes extending therethrough, the evaporator sections of the heat pipes being arranged side by side and thermally contacting with bottom side of the first fin assembly. 
   
   
       12 . The heat dissipation device as described in  claim 11 , wherein each of the second fin assemblies defines a pair of slots on one side facing the first fin assembly, the other four condenser sections of the heat pipes interconnecting the second fin assemblies and the first fin assembly being received in the slots of the second fin assemblies correspondingly. 
   
   
       13 . The heat dissipation device as described in  claim 12 , wherein the slots of each second fin assembly receive two condenser sections of different heat pipes therein.