Air guiding structure

Abstract

An air guiding structure includes a plurality of fins capable of swinging, an actuation member connected to each fin, and a memory deformable element connected to the outermost fin. When the memory deformable element is at a normal temperature, the fins remain at a normal angle; when deforming because of heat, the memory deformable element pulls the fins to swing. Further, the actuation member drives each fin to rotate to a working angle, and thus the air exhaustion direction is changed according to the temperature effect.

1 . An air guiding structure, disposed on an air outlet of an electronic device, the air guiding structure comprising:
 a plurality of fins, mounted in the air outlet and capable of rotating; and   a memory deformable element, having one end fixed to the electronic device, and the other end connected to one of the fins, such that the memory deformable element pulls the fins to swing together when deforming because of heat.   
   
   
       2 . The air guiding structure according to  claim 1 , further comprising an actuation member connected to the fins, so as to drive the fins to swing together. 
   
   
       3 . The air guiding structure according to  claim 2 , wherein a connection portion is disposed on each fin, a plurality of ferrules respectively corresponding to the connection portions is disposed on the actuation member, the connection portions of the fins are respectively pivoted to the ferrules, such that the fins are capable of rotating together. 
   
   
       4 . The air guiding structure according to  claim 1 , further comprising a restoring element with one end disposed on a side edge of an inner wall of the air outlet, and the other end connected to the outermost fin on a side opposite to the memory deformable element, wherein the memory deformable element has an expanded and deformed state at a normal temperature and a contracted original state when heated, such that the fins remain at a normal angle and swing to a working angle respectively, and the restoring element restores the memory deformable element to the expanded and deformed state at the normal temperature. 
   
   
       5 . The air guiding structure according to  claim 1 , wherein a plurality of dowel holes is respectively disposed at top and bottom of an inner wall of the air outlet, a pair of rotating shafts is respectively disposed at top and bottom of each fin, and the fins swing by fitting the rotating shafts into the dowel holes. 
   
   
       6 . The air guiding structure according to  claim 5 , wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is smaller than a distance from the place where the memory deformable element is connected to the fin to the mean line. 
   
   
       7 . The air guiding structure according to  claim 5 , wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is equal to a distance from the place where the memory deformable element is connected to the fin to the mean line. 
   
   
       8 . The air guiding structure according to  claim 5 , wherein each fin has a mean line, and a distance from a place where the memory deformable element is connected to the fin to the rotating shaft is greater than a distance from the place where the memory deformable element is connected to the fin to the mean line. 
   
   
       9 . The air guiding structure according to  claim 1 , further comprising a heat conductive member with one end connected to the memory deformable element and the other end connected to a heatsink of the electronic device. 
   
   
       10 . The air guiding structure according to  claim 1 , wherein one of the fins has a pull-rod, and the memory deformable element has one end connected to the pull-rod and the other end fixed to a heat dissipation element of the electronic device. 
   
   
       11 . An air guiding structure, disposed on an air outlet of an electronic device, the air guiding structure comprising:
 a plurality of fins, mounted in the air outlet and capable of rotating;   an actuation member, connected to the fins; and   a memory deformable element, having one end fixed to the electronic device, and the other end connected to the actuation member, such that the memory deformable element pulls the fins to swing together when deforming because of heat.   
   
   
       12 . The air guiding structure according to  claim 11 , wherein a connection portion is disposed on each fin, a plurality of ferrules respectively corresponding to the connection portions is disposed on the actuation member, the connection portions of the fins are respectively pivoted to the ferrules, such that the fins are capable of rotating together. 
   
   
       13 . The air guiding structure according to  claim 11 , further comprising a restoring element with one end disposed on a side edge of an inner wall of the air outlet, and the other end connected to the outermost fin on a side opposite to the memory deformable element, wherein the memory deformable element has an expanded and deformed state at a normal temperature and a contracted original state when heated, so that the fins remain at a normal angle and swing to a working angle respectively, and the restoring element restores the memory deformable element to the expanded and deformed state at the normal temperature. 
   
   
       14 . The air guiding structure according to  claim 11 , wherein a plurality of dowel holes is respectively disposed at top and bottom of an inner wall of the air outlet, a pair of rotating shafts is respectively disposed at top and bottom of each fin, and the fins swing by fitting the rotating shafts into the dowel holes. 
   
   
       15 . The air guiding structure according to  claim 11 , further comprising a heat conductive member with one end connected to the memory deformable element and the other end connected to a heatsink of the electronic device. 
   
   
       16 . The air guiding structure according to  claim 11 , wherein one of the fins has a pull-rod, and the memory deformable element has one end connected to the pull-rod and the other end fixed to a heat dissipation element of the electronic device.