US2009317290A1PendingUtilityA1
Multicomponent Copper Alloy and Its Use
Est. expiryApr 28, 2026(expired)· nominal 20-yr term from priority
C22C 9/02F16C 2204/10F16C 33/121C22C 1/06C22C 9/06
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Claims
Abstract
The invention relates to a multicomponent copper alloy comprising [in % by weight]: Ni from 1.0 to 15.0%, Sn from 2.0 to 12.0%, Mn from 0.1 to 5.0%, Si from 0.1 to 3.0%, balance Cu and unavoidable impurities, if desired up to 0.5% of P, if desired individually or in combination up to 1.5% of Ti, Co, Cr, Al, Fe, Zn, Sb, if desired individually or in combination up to 0.5% of B, Zr, S, if desired up to 5% of Pb, and having Mn—Ni silicide phases which have a mass ratio of the elements [w(Mn)+w(Ni)]/w(Si) in the range from 1.8/1 to 7/1.
Claims
exact text as granted — not AI-modified1 . Multicomponent copper alloy consisting of [in % by weight]:
Ni 1.0 to 15.0%, Sn 2.0 to 12.0%, Mn 0.1 to 5.0%, Si 0.1 to 3.0%, remainder Cu and unavoidable impurities, optionally up to 0.5% P, optionally individually or in combination up to 1.5% Ti, Co, Cr, Al, Fe, Zn, Sb, optionally individually or in combination up to 0.5% B, Zr, S, optionally up to 5% Pb, with Mn—Ni silicide phases, which have a mass ratio of the elements [w(Mn)+w(Ni)]/w(Si) in the range of from 1.8/1 to 7/1.
2 . Multicomponent copper alloy according to claim 1 , characterized in that the mass fraction of the elements satisfies the following relationship: [w(Ni)−w(Mn)−w(Sn)]>0.
3 . Multicomponent copper alloy according to claim 1 , characterized in that the mass fraction of the elements satisfies the following relationship: w(Mn)>w(Si).
4 . Multicomponent copper alloy according to claim 1 , characterized in that the value of the elongation at break A 5 at a temperature of 400° C. is more than 10%.
5 . Multicomponent copper alloy according to claim 1 , characterized in that the crystallite size of the Mn—Ni silicide phases is from 0.1 to 100 μm.
6 . Multicomponent copper alloy according to claim 1 , characterized in that it contains from 0.01 to 0.06% P, finely distributed Ni phosphide phases being formed in the matrix.
7 . Multicomponent copper alloy according to claim 6 , characterized in that the average grain size of the finely distributed Ni phosphide phases is less than 100 nm.
8 . Multicomponent copper alloy according to claim 1 , characterized in that it contains from 0.1 to 2.5% Mn and from 0.1 to 1.5% Si.
9 . Multicomponent copper alloy according to claim 8 , characterized in that it contains from 0.1 to 1.6% Mn and from 0.1 to 0.7% Si.
10 . Multicomponent copper alloy according to claim 1 , characterized in that it has undergone at least one heat treatment at from 300 to 500° C.
11 . Multicomponent copper alloy according to claim 1 , characterized in that it has undergone at least one heat treatment at from 600 to 800° C.
12 . Multicomponent copper alloy according to claim 1 , characterized in that it has undergone a combination of at least one solution anneal at from 600 to 800° C. and at least one age hardening at from 300 to 500° C.
13 . Use of the multicomponent copper alloy according to claim 1 for friction-bearing elements or jack connectors.Join the waitlist — get patent alerts
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