Metal surface treatment method

Abstract

A metal surface treatment method includes: a shot-peening step of shot-peening a dissimilar metal particle ( 2 ) on a surface of a base metal ( 1 ), the dissimilar metal particle ( 2 ) being a metal particle different from the base metal ( 1 ), to provide a dissimilar metal film ( 3 ) on the surface of the base metal ( 1 ); and an electron beam irradiation step of irradiating the surface of the base metal ( 1 ) with an electron beam ( 4 ), the surface of the base metal ( 1 ) having been provided with the dissimilar metal film ( 3 ) in the shot-peening step, to bond the dissimilar metal film ( 3 ) and the base metal ( 1 ) together.

1 - 42 . (canceled) 
     
     
         43 . A metal surface treatment method comprising:
 a shot-peening step of shot-peening a dissimilar metal particle on a surface of a base metal, the dissimilar metal particle being a metal particle different from the base metal, to provide a dissimilar metal film on the surface of the base metal; and   an electron beam irradiation step of irradiating the surface of the base metal with an electron beam, the surface of the base metal having been provided with the dissimilar metal film in the shot-peening step, to bond the dissimilar metal film and the base metal together.   
     
     
         44 . The metal surface treatment method as recited in  claim 43 , wherein the dissimilar metal film and the base metal are bonded together in an alloyed state by means of an electron beam irradiation. 
     
     
         45 . The metal surface treatment method as recited in  claim 43 , wherein said electron beam irradiation step includes melting the dissimilar metal particle and bonding the dissimilar metal film to the base metal by being irradiated with the electron beam, after the dissimilar metal particle has been shot-peened on the surface of the base metal, the dissimilar metal particle being a metal particle with a low melting point as compared with the base metal. 
     
     
         46 . The metal surface treatment method as recited in  claim 43 , wherein said electron beam irradiation step includes melting the base metal and bonding the dissimilar metal film to the base metal by being irradiated with the electron beam, after the dissimilar metal particle has been shot-peened on the surface of the base metal, the dissimilar metal particle being a metal particle with a high melting point as compared with the base metal. 
     
     
         47 . The metal surface treatment method as recited in  claim 43 , wherein the shot-peening step, a plurality of dissimilar metal particles composed of different metals are jetted on the surface of the base metal. 
     
     
         48 . The metal surface treatment method as recited in  claim 43 , wherein the shot-peening step, the metal particles with different average particle sizes are jetted on the surface of the base metal. 
     
     
         49 . The metal surface treatment method as recited in  claim 43 , wherein the surface of the base metal having been provided with the dissimilar metal film in the shot-peening step is further irradiated with the electron beam in the second electron beam irradiation step so as to bond the dissimilar metal film and the base metal together and a surface layer is provided on the surface of the base metal, and that the shot-peening step and the electron beam irradiation step are repeated a plurality of times to laminate a plurality of surface layers ( 5 ) on the surface of the base metal. 
     
     
         50 . The metal surface treatment method as recited in  claim 43 , wherein the shot-peening step, the dissimilar metal particle used for the shot-peening operation includes at least either of W, C, B, Ti, Ni, Cr, Si, Mo, Ag, Au, Ba, Be, Ca, Co, Cu, Fe, F, fluoride, Mg, Mn, Nb, Pt, S, a sulfide, Ta, or V. 
     
     
         51 . The metal surface treatment method as recited in  claim 43 , wherein the shot-peening step, the dissimilar metal particle used for the shot-peening operation is an alloy of a plurality of metals and a compound containing a metal. 
     
     
         52 . The metal surface treatment method as recited in  claim 43 , wherein the shot-peening step, the dissimilar metal particle used for the shot-peening operation is 0.03 μm or more in an average particle size. 
     
     
         53 . The metal surface treatment method as recited in  claim 43 , wherein in the shot-peening step, the dissimilar metal particle used for the shot-peening operation is 500 μm or less in an average particle size. 
     
     
         54 . The metal surface treatment method as recited in  claim 43 , wherein the base metal is either of: a metal including Fe, Al, Cu, an iron base alloy, an aluminum base alloy, and a copper base alloy; a metal including Ag, Au, Ba, Ca, Co, F, fluoride, Mg, Mn, Ni, Nb, Pt, S, a sulfide, Ta, Ti, and V; a silver base alloy; a gold base alloy; a calcium base alloy; a cobalt base alloy; a chromium base alloy; a magnesium base alloy; a manganese base alloy; a nickel base alloy; a niobium base alloy; a tantalum base alloy; a titanium base alloy; a vanadium base alloy; or a sintered metal. 
     
     
         55 . The metal surface treatment method as recited in  claim 43 , wherein the electron beam irradiation step, the base metal having been provided with the dissimilar metal film is irradiated with the electron beam in a vacuum or in a gas. 
     
     
         56 . The metal surface treatment method as recited in  claim 43 , wherein the electron beam irradiation step, the surface is irradiated with the electron beam to bond the dissimilar metal film and the base metal together to provide the surface layer on the surface of the base metal, and then the surface of the surface layer is polished in a polishing step. 
     
     
         57 . A metal surface treatment method comprising:
 a temporary filming step where a dissimilar metal particle being a metal particle different from a base metal is accelerated toward and impinged upon the base metal and attached to a surface of the base metal via a binder becoming lost by energy of an energy beam so as to provide a powdered metal layer on the surface of the base metal, and   a beam irradiation step where the surface of the base metal having the powdered metal layer provided thereon in a temporary filming step is irradiated with an energy beam of an electron beam or a laser beam, the binder becomes lost, and the powdered metal layer and the base metal are bonded together to provide a surface layer on the surface of the base metal.   
     
     
         58 . The metal surface treatment method as recited in  claim 57 , further comprising a polishing step in which the surface of the surface layer is polished after the beam irradiation step. 
     
     
         59 . The metal surface treatment method as recited in  claim 56 , wherein the polishing step, the surface layer is polished by shot-blasting an abrasive particle thereon. 
     
     
         60 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle is accelerated by energy of a pressurized fluid. 
     
     
         61 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle is accelerated by the effect of an electric field and/or a magnetic field. 
     
     
         62 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle with a low melting point as compared with the base metal is impinged upon the surface of the base metal. 
     
     
         63 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle with a high melting point as compared with the base metal is impinged upon the surface of the base metal. 
     
     
         64 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, a plurality of kinds of dissimilar metal particles being different metals are impinged upon the surface of the base metal. 
     
     
         65 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particles with different average particle sizes are impinged upon the surface of the base metal. 
     
     
         66 . The metal surface treatment method as recited in  claim 57 , wherein the beam irradiation step, the powdered metal layer and the base metal are bonded together into an alloyed state. 
     
     
         67 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step and the beam irradiation step are repeated a plurality of times to laminate a plurality of surface layers on the surface of the base metal. 
     
     
         68 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle  2  accelerated toward and impinged upon the surface of the base metal  1  includes at least either of: W, C, B, Ti, Ni, Cr, Si, Mo, Ag, Au, Ba, Be, Ca, Co, Cu, Fe, Mg, Mn, Nb, Pt, Ta, V, F, S; or fluoride, a sulfide, nitride, a carbide, or boride of such metals. 
     
     
         69 . The metal surface treatment method as recited in  claim 68 , wherein the temporary filming step, the dissimilar metal particle including either of molybdenum disulfide, tungsten sulfide, or boron nitride is accelerated toward and impinged upon the surface of the base metal. 
     
     
         70 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle being an alloy of a plurality of metals and a compound containing a metal is accelerated toward and impinged upon the surface of the base metal. 
     
     
         71 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle with an average particle size thereof being 0.03 μm or more is accelerated toward and impinged upon the surface of the base metal. 
     
     
         72 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the dissimilar metal particle with an average particle size thereof being 500 μm or less is accelerated toward and impinged upon the surface of the base metal. 
     
     
         73 . The metal surface treatment method as recited in  claim 57 , wherein the base metal is either of: a metal including Fe, Al, Cu, an iron base alloy, an aluminum base alloy, and a copper base alloy; a metal including Ag, Au, Ba, Ca, Co, Mg, Mn, Ni, Nb, Pt, Ta, Ti, and V; a silver base alloy; a gold base alloy; a calcium base alloy; a cobalt base alloy; a chromium base alloy; a magnesium base alloy; a manganese base alloy; a nickel base alloy; a niobium base alloy; a tantalum base alloy; a titanium base alloy; a vanadium base alloy; a sintered metal; F, S; or fluoride, a sulfide, nitride, a carbide or boride of such metals. 
     
     
         74 . The metal surface treatment method as recited in  claim 57 , wherein the beam irradiation step, the base metal provided with the powdered metal layer thereon is irradiated with the energy beam in a vacuum or in a gas. 
     
     
         75 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, a binder being water-soluble or organic solvent-soluble is used as the binder allowing for attachment of the dissimilar metal particle. 
     
     
         76 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, an oil is used as the binder for attaching the dissimilar metal particle to the base metal. 
     
     
         77 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, saccharides or celluloses are used as the binder for attaching the dissimilar metal particle to the base metal. 
     
     
         78 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, a substance used as the binder  6 , alone or in a mixture of a plurality of kinds, to attach the dissimilar metal particle  2  to the base metal  1  is either of:
 a material such as gum Arabic, tragacanth, gum karaya, caramel, starch, soluble starch, dextrin, α starch, sodium alginate, gelatin, locust bean gum, and casein;   a semi-synthetic material derived from a natural product, the material being either of lignosulfonate, carboxymethyl cellulose sodium salt, methyl cellulose, hydroxyethyl cellulose, sodium salt of carboxymethylated starch, hydroxy-ethylated starch, sodium salt of starch phosphate, hydroxypropyl cellulose, hydroxypropyl methyl cellulose, ethyl cellulose, acetyl cellulose, or ester gum; or   a composite being either of polyvinyl alcohol, polyvinyl methyl ether, polyacrylamide, sodium salt of polyacrylic acid, water-soluble copolymer, copolymer of partially saponificated vinyl acetate and vinyl ether, acrylic acid, methacrylic acid, maleic acid and polymer or copolymer of maleic acid ester or salt, polyethylene glycol, polyethylene oxide, polyvinyl pyrrolidone, vinylpyrrolidone-vinyl acetate copolymer, polyvinyl acetate, coumarone resin, petroleum resin, or phenolic resin.   
     
     
         79 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, a radiation hardening-type resin cured by ultraviolet irradiation is used as the binder for attaching the dissimilar metal particle to the base metal. 
     
     
         80 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the powdered metal layer is provided through a process that the binder is coated on the surface of the base metal and the dissimilar metal particle is accelerated toward and impinged upon the surface of the base metal having been coated with the binder. 
     
     
         81 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, both of the binder and the dissimilar metal particle are accelerated toward and impinged upon the surface of the base metal to provide the powdered metal layer. 
     
     
         82 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the powdery binder and the dissimilar metal particle are electrostatically attached to the surface of the base metal and subsequently heated to bond the dissimilar metal particle to the base metal by means of the binder to provide the powdered metal layer. 
     
     
         83 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, the powdered metal layer is provided on the surface of the base metal through a process that the dissimilar metal particle is attached to the surface of the base metal via the binder of an ultraviolet hardening type, and the binder of the ultraviolet hardening type is cured by ultraviolet irradiation. 
     
     
         84 . The metal surface treatment method as recited in  claim 57 , wherein the temporary filming step, a coating material is sprayed on the surface of the powdered metal layer.