Planarization System

Abstract

An embodiment of a planarization system for planarizing a substrate includes a planarizing surface and an encircling element formed to at least partially laterally enclose the substrate, wherein the planarizing system is configured to planarize the substrate with the substrate abutting the planarizing surface during a relative lateral movement between the substrate and the planarizing surface. The substrate is at least partially laterally enclosed by the encircling element. The encircling element abuts the planarizing surface.

1 . A planarization system for planarizing a substrate, comprising:
 a planarizing surface; and   an encircling element formed to only partially laterally enclose the substrate,   wherein the planarization system is configured to planarize the substrate with the substrate abutting the planarizing surface during a relative lateral movement between the substrate and the planarizing surface, the substrate being only partially laterally enclosed by the encircling element, and wherein the encircling element abuts the planarizing surface.   
     
     
         2 . The planarization system according to  claim 1 , wherein the encircling element comprises a recess such that a distance between the substrate and a circumference of the recess is smaller than or equal to one inch. 
     
     
         3 . The planarization system according to  claim 1 , wherein the encircling element laterally encloses 50% or more of the circumference of the substrate. 
     
     
         4 . The planarization system according to  claim 1 , comprising a substrate holder, wherein the substrate holder comprises the encircling element. 
     
     
         5 . The planarization system according to  claim 4 , wherein the encircling element comprises a retaining ring such that a free movement of the substrate is limited with respect to the substrate holder. 
     
     
         6 . The planarization system according to  claim 4 , wherein the substrate holder comprises a carrier to urge the substrate against the planarizing surface. 
     
     
         7 . The planarization system according to  claim 6 , wherein the carrier comprises a weight such that the carrier is adapted to press the substrate against the planarizing surface due to its weight. 
     
     
         8 . The planarization system according to  claim 6 , wherein the substrate holder comprises a spring element, wherein the spring element couples the carrier to the encircling element. 
     
     
         9 . The planarization system according to  claim 8 , wherein the spring element is adapted to press the encircling element onto the planarizing surface. 
     
     
         10 . The planarization system according to  claim 1 , wherein the planarizing surface is formed by a pad. 
     
     
         11 . The planarization system according to  claim 10 , wherein the pad is configured to rotate about a rotation axis. 
     
     
         12 . The planarization system according to  claim 1 , wherein the planarization system is at least one of a lapping system, a polishing system and/or a CMP system. 
     
     
         13 . The planarization system according to  claim 1 , further comprising a motor configured to create the relative lateral movement between the substrate and the planarizing surface. 
     
     
         14 . A substrate holder for holding a substrate during a lateral relative movement between the substrate and a planarizing surface, comprising:
 a carrier configured to urge the substrate against the planarizing surface; and   an encircling element formed to only partially laterally enclose the substrate,   wherein the encircling element is vertically movably attached to the carrier so as to abut the planarizing surface during urging the substrate against the planarizing surface.   
     
     
         15 . The substrate holder according to  claim 14 , wherein the encircling element comprises a recess such that a distance between the substrate and a circumference of the recess is less than or equal to one inch. 
     
     
         16 . The substrate holder according to  claim 14 , wherein the encircling element laterally encloses 50% or more of the circumference of the substrate. 
     
     
         17 . The substrate holder according to  claim 14 , wherein the encircling element comprises a retaining ring, wherein the retaining ring is adapted to limit a free movement of the substrate with respect to the substrate holder. 
     
     
         18 . The substrate holder according to  claim 14 , wherein the carrier comprises a weight such that the carrier is adapted to press the substrate against the planarizing surface. 
     
     
         19 . The substrate holder according to  claim 14 , comprising a spring element coupling the carrier and the encircling element. 
     
     
         20 . The substrate holder according to  claim 19 , wherein the spring element is adapted to press the encircling element onto the planarizing surface. 
     
     
         21 . The substrate holder according to  claim 14 , wherein the substrate holder is a substrate holder for at least one of a lapping system, a polishing system and/or a CMP system. 
     
     
         22 . A method for planarizing a substrate abutting a planarizing surface, comprising:
 creating a relative lateral movement between the substrate and the planarizing surface such that an encircling element formed to only partially laterally enclose the substrate abuts the planarizing surface.   
     
     
         23 . The method according to  claim 22 , further comprising providing the substrate abutting the planarizing surface. 
     
     
         24 . The method according to  claim 22 , further comprising providing a substrate holder comprising the encircling element. 
     
     
         25 . A method for planarizing a substrate, comprising:
 creating a relative lateral movement between the substrate and a planarizing surface;   exerting a pressure onto the planarizing surface in an area only partially laterally surrounding the substrate.   
     
     
         26 . The method according to  claim 25 , wherein exerting the pressure comprises providing an encircling element abutting the planarizing surface. 
     
     
         27 . A planarization system for planarizing a substrate, comprising:
 a planarizing surface; and   a substrate holder, the substrate holder comprising an encircling element formed to at least partially laterally enclose the substrate, a carrier formed to urge the substrate against the planarizing surface, and a spring element, wherein the spring element couples the carrier to the encircling element, and the spring element comprises a coil spring,   wherein the planarization system is configured to planarize the substrate with the substrate abutting the planarizing surface during a relative lateral movement between the substrate and the planarizing surface, the substrate being at least partially laterally enclosed by the encircling element, and wherein the encircling element abuts the planarizing surface.   
     
     
         28 . A substrate holder for holding a substrate during a lateral relative movement between the substrate and a planarizing surface, comprising:
 a carrier configured to urge the substrate against the planarizing surface;   an encircling element formed to at least partially laterally enclose the substrate; and   a spring element coupling the carrier and the encircling element, wherein the spring element comprises a coil spring, and   wherein the encircling element is vertically movably attached to the carrier so as to abut the planarizing surface during urging the substrate against the planarizing surface.