Connection method and substrate

Abstract

A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.

1 . A connection method comprising the step of
 connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.   
     
     
         2 . The connection method according to  claim 1 , wherein a higher point of the two points is a point on a line of an electronic part mounted on a substrate, and a lower point of the two points is a point on a line of the substrate. 
     
     
         3 . The connection method according to  claim 2 , wherein an area along which the thickness of the dielectric element decreases toward a connection part with the line of the substrate is formed in the end portion of the electronic part composed of a dielectric material, and the two points having different heights are connected by a line disposed along the area. 
     
     
         4 . The connection method according to  claim 2 , wherein steps at which the thickness of the dielectric element decreases toward a connection part with a line of the substrate are formed in the end portion of the electronic part composed of a dielectric material, and the two points having different heights are connected by a line disposed on the steps. 
     
     
         5 . A substrate, wherein two points through which a signal flows are connected using a line on a dielectric element, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element. 
     
     
         6 . The substrate according to  claim 5 , wherein a higher point of the two points is a point on a line of an electronic part mounted on a substrate, and a lower point of the two points is a point on a line of the substrate. 
     
     
         7 . The substrate according to  claim 6 , wherein an area along which the thickness of the dielectric element decreases toward a connection part with the line of the substrate is formed in the end portion of the electronic part composed of a dielectric material, and the two points having different heights are connected by a line disposed along the area. 
     
     
         8 . The substrate according to  claim 6 , wherein steps at which the thickness of the dielectric decreases toward a connection part with the line of the substrate are formed in the end portion of the electronic part composed of a dielectric material, and the two points having different heights are connected by a line disposed on the steps.