Thermal conduction principle and device of the multi-layers structure with different thermal characteristics

Abstract

The present invention innovatively discloses a relay thermal conductor being made of material with better thermal conducting characteristics, wherein one end or face of the relay thermal conductor is thermal conductively coupled with the first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having higher specific heat capacity is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body.

1 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics, having a relay thermal conductor being made of material with better thermal conducting characteristics, one end or face of the relay thermal conductor is thermal conductively coupled with at least one first thermal body for heating or cooling; while another end or face of the relay thermal conductor is thermal conductively coupled with the interface thermal conductor, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conduction carrier between the relay thermal conductor and the second thermal body, thus is favorable for thermal conduction when there is a temperature difference between the first thermal body and the second thermal body. 
   
   
       2 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 1 , wherein it has a relay thermal conductor being made of material with better thermal conducting characteristics between the first thermal body to be thermal conductively coupled with the first thermal body; while the interface thermal conductor is coupled with the relay thermal conductor between the relay thermal conductor and the second thermal body, wherein the interface thermal conductor having both or either one of the thermal conductivity characteristics including 1) a higher specific heat capacity relative to the relay thermal conductor, or 2) a better thermal conductivity coefficient or thermal radiation coefficient (thermal emission) relative to the relay thermal conductor toward the second thermal body is used as the thermal conductor between the relay thermal conductor and the second thermal conductor; it mainly comprises including:
 The thermally conducting device ( 100 ) is constituted by at least two layers of thermal conducting material with different thermal characteristics, wherein the relay thermal conductor ( 102 ) with better thermal conductivity coefficient is coupled with the first thermal body ( 101 ), and the interface thermal conductor ( 103 ) with higher specific heat capacity is coupled between the relay thermal conductor ( 102 ) and the second thermal body ( 104 ), thereby constituting the thermally conducting device ( 100 );   The thermally conducting device ( 100 ) is installed between the first thermal body ( 101 ) and the second thermal body ( 104 ), and the thermally conducting device ( 100 ) can be constituted including by the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ), wherein   The first thermal body ( 101 ): It can be an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal, or powder like matters;   The relay thermal conductor ( 102 ): It is constituted by at least one layer of solid, gaseous, liquid, colloidal or powder like matters with relatively better thermal conductivity coefficients, wherein the thermal conductivity coefficient of the relay thermal conductor and the first thermal body ( 101 ) is better than the one of the interface thermal conductor ( 103 ), i.e. its thermal conducting rate is faster than the one of the interface thermal conductor ( 103 ), and the thermal conduction coupling area between the relay thermal conductor ( 102 ) and the first thermal body ( 101 ) is smaller than the thermal conduction coupling area between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 );   The interface thermal conductor ( 103 ): It is made of at least one layer of solid, gaseous, liquid, colloidal or powder like matters, wherein both or either one of its material thermal conductivity characteristics such as 1) the specific heat capacity, or 2) the thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body ( 104 ) are better than the ones of the relay thermal conductor ( 102 ), wherein it is installed between the relay thermal conductor ( 102 ) and the second thermal body ( 104 ), and the thermal conduction coupling area between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) is larger or equal to the thermal conduction coupling area between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 );   The second thermal body ( 104 ): It is an active cooling or heating thermal body or a passive heat absorbing or heat release thermal body being constituted by solid, gaseous, liquid, colloidal or powder like matters;   For the thermal conduction principle and device of the multi-layers structure with different thermal characteristics, the geometric shapes of the thermal conduction coupling surface between the first thermal body ( 101 ) and the relay thermal conductor ( 102 ) as well as the thermal conduction coupling surface between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) can be optionally selected as needed;   It is through above said particular structures to lower the thermal resistance between the first thermal body ( 101 ) and the second thermal body ( 104 ).   
   
   
       3 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the corresponding relationship between the first thermal body ( 101 ), the relay thermal conductor ( 102 ), the interface thermal conductor ( 103 ), the second thermal body ( 104 ) are as following:
 The thermally conducting device ( 100 ) is installed between the first thermal body ( 101 ) and the second thermal body ( 104 );   The thermally conducting device ( 100 ) is constituted by the thermal conductor having at least two layers of material with different thermal characteristics, wherein the relay thermal conductor ( 102 ) having a better thermal conductivity coefficient relative to the one between interface thermal conductor ( 103 ) and the first thermal body ( 101 ) is coupled with the first thermal body ( 101 ), and the interface thermal conductor ( 103 ) having both or either one of its material thermal conductivity characteristics such as 1) a higher heat capacity, or 2) a thermal conductivity coefficient or thermal radiation coefficient (thermal emission) toward the second thermal body ( 104 ) are better than the ones of the relay thermal conductor ( 102 ) is coupled between the relay thermal body ( 102 ) and the second thermal body ( 104 );   The thermal conductivity coefficient of the material constituting the relay thermal conductor ( 102 ) is better than the one of the interface thermal conductor ( 103 );   Two or either one of the thermal conductivity characteristics such as the material specific heat capacity of the interface thermal conductor ( 103 ) or the thermal conductivity coefficient or the thermal radiation coefficient of the material constituting the interface thermal conductor ( 103 ) toward the second thermal body ( 104 ) are better than the ones of the relay thermal conductor ( 102 );   The thermal conduction coupling area between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ) is larger than the thermal conduction coupling area between the relay thermal conductor ( 102 ) and the first thermal body ( 101 ) so as to reduce the thermal resistance;   The thermal conduction coupling area between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) is larger or equal to the thermal conduction coupling area between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ) so as to reduce the thermal resistance;   If the temperature of first thermal body ( 101 ) is higher than the one of the second thermal body ( 104 ) in the above said structure, the thermal energy of the first thermal body ( 101 ) is externally diffused to execute thermal conduction to the relay thermal conductor ( 102 ) with better thermal conductivity coefficient through the smaller thermal conducting coupling area between the first thermal body ( 101 ) and the relay thermal conductor ( 102 ); while the thermal energy is diffused to the interface thermal conductor ( 103 ) with larger specific heat capacity through the larger thermal conduction coupling area between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ), and the thermal energy is released by the interface thermal conductor ( 103 ) to the second thermal body ( 104 ) through the same or larger thermal conduction coupling area;   If the temperature of first thermal body ( 101 ) is lower than the one of the second thermal body ( 104 ) in the above said structure, the thermal energy of the second thermal body ( 104 ) is diffusely conducted to the interface thermal conductor ( 103 ) with larger specific heat capacity through the larger thermal conducting coupling area between the second thermal body ( 104 ) and the interface thermal conductor ( 103 ), while the thermal energy is conducted to the relay thermal conductor ( 102 ) through the smaller thermal conduction coupling area coupled with the interface thermal conductor ( 103 ) and the relay thermal conductor ( 102 ), and the thermal energy is further released to the first thermal body ( 101 ) through the smaller thermal conduction coupling area of the relay thermal conductor ( 102 ) with better thermal conductivity coefficient.   
   
   
       4 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein it can be further constituted by the following structures:
 If at least one of the first thermal body ( 101 ), or the second thermal heater ( 102 ), or the interface thermal conductor ( 103 ), or the second thermal body ( 104 ) is made of gaseous, liquid, colloidal, or powder like matters, then a container structure can be installed for housing them, wherein the container structure can be made of a good thermal conductor or a non-thermal conductor, or made of material with better thermal conductivity coefficient to constitute the relay thermal conductor ( 102 ), or made of material with larger specific heat capacity to constitute the function of interface thermal conductor ( 103 ).   
   
   
       5 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the thermal conduction coupling surface and the combined surface between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area. 
   
   
       6 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein when the relay thermal conductor ( 102 ) or the interface thermal conductor ( 103 ) is a multiple layers structure, the relationships between the additional intermediate thermal conducting layer ( 110 ) and the relay thermal conductor ( 102 ) as well as the interface thermal conductor ( 103 ) are as the following:
 If the specific heat capacity of the intermediate thermal conducting layer ( 110 ) is larger than the one of the relay thermal conductor ( 102 ), but smaller than the one of the interface thermal conductor ( 103 ), then when the structure of multiple intermediate thermal conducting layers ( 110 ) is adopted, the specific heat capacity is smaller for the intermediate thermal conducting layer ( 110 ) which is closer to the relay thermal conductor ( 102 ) but still larger than the one of the relay thermal conductor ( 102 );   The thermal conductivity coefficient of the intermediate thermal conducting layer ( 110 ) is better than the one of the interface thermal conductor ( 103 ), and the thermal conductivity coefficient of the relay thermal conductor ( 102 ) is better than the one of the intermediate thermal conducting layer ( 110 ); then when the structure of multiple intermediate thermal conducting layers ( 110 ) is adopted, the thermal conductivity coefficient is better for the intermediate thermal conducting layer ( 110 ) which is closer to the relay thermal conductor ( 102 ), but still slightly smaller than the one of the relay thermal conductor ( 102 );   The thermal conduction coupling area between the relay thermal conductor ( 102 ) and the intermediate thermal conducting layer ( 110 ) is larger than the thermal conduction coupling area between the intermediate thermal conducting layer ( 110 ) and the interface thermal conductor ( 103 ), then when the structure of multiple intermediate thermal conducting layers ( 110 ) is optionally installed, its thermal conduction coupling area is larger for the intermediate layer which is closer to the interface thermal conductor ( 103 ).   
   
   
       7 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 6 , wherein if the number of above said intermediate thermal conducting layers ( 110 ) is two or more than two, then the selection of the thermal conductivity coefficient and specific heat capacity in the thermal characteristics as well as the selection of the thermal conduction coupling area size of the two sides of the intermediate thermal conducting layer ( 110 ) is followed a structural principal that the thermal conduction area size of each layer of a combined structure constituted in sequencing from the first thermal body ( 101 ) to the relay thermal conductor ( 102 ) to the intermediate thermally conductive layer ( 110 ) to the interface thermal conductor ( 103 ) and to the second thermal body ( 104 ) is sequentially and gradually increasing layer by layer. 
   
   
       8 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 6 , wherein the thermal conduction coupling surface and the combined surface between the relay thermal conductor ( 102 ) and the intermediate thermally conductive layer ( 110 ) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area. 
   
   
       9 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 6 , wherein the thermal conduction coupling surface and the combined surface between the intermediate thermally conductive layer ( 110 ) and the interface thermal conductor ( 103 ) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area. 
   
   
       10 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 7 , wherein if two or more than two layers of the intermediate thermally conductive layer ( 110 ) is selected, the thermal conduction coupling surface and the combined surface between at least two intermediate thermally conductive layers ( 110 ) can be optionally selected as needed to be constituted by one or more than one combined structures of the following, such as combined by two plane surfaces with at least one combined surface is in a round, square, rectangle, polygon, radiate star shape or other geometric shapes, concavely and convexly combined, clamped combined, combined by dovetail slots, combined by T type slots, combined by stud/hole fastening, or concavely and convexly combined by multi-fins, or combined by other conventional methods of combination etc. to enlarge the conducting area. 
   
   
       11 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2  or  claim 7 , wherein the thermally conducting device ( 100 ) is integrally constituted by the first thermal body ( 101 ), the relay thermal conductor ( 102 ), the interface thermal conductor ( 103 ), the second thermal body ( 104 ) or the further optionally installed intermediate thermal conducting layer ( 110 ) being included, wherein if all or partially neighboring thermal conductors constituting the thermally conducting device ( 100 ) are solid bodies, then the thermal conduction coupling surface between the two neighboring thermal conductors can be combined by the following one or more than one methods, including:
 1) Locking by additional screws and nuts; or   2) Screwing by itself own screw bolt and screw hole; or   3) Riveting; or   4) Pressing; or   5) Clamping; or   6) Adhesion; or   7) Soldering/welding; or   8) Fusion by frictions; or   9) Neighboring thermal conductors are combined by casting or electroplating; or   10) The thermal conducting structure between neighboring thermal conductors and another thermal conductor can be combined by either immobile or mobile attaching; or   11) The neighboring thermal conductors are in tightly touched combination; or   12) The neighboring thermal conductors are in enclosed combination.   
   
   
       12 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2  or  claim 7 , wherein the thermal conduction coupling surface between the first thermal body ( 101 ) and the relay thermal conductor ( 102 ); or between the relay thermal conductor ( 102 ) and the intermediate thermal conducting layer ( 110 ) when the intermediate thermal conducting layer ( 110 ) is installed; or between the intermediate thermal conducting layer ( 110 ) and the intermediate thermal conducting layer ( 110 ) when multiple intermediate thermal conducting layers ( 110 ) are installed; or between the intermediate thermal conducting layer ( 110 ) and the interface thermal conductor ( 103 ); or between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ) when the intermediate thermal conducting layer ( 110 ) is not installed; or between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) can be combined by one or more than one of the following methods, including:
 1) Locking by additional screws and nuts; or   2) Screwing by itself own screw bolt and screw hole; or   3) Riveting; or   4) Pressing; or   5) Clamping; or   6) Adhesion; or   7) Soldering/welding; or   8) Fusion by frictions; or   9) Neighboring thermal conductors are combined by casting or electroplating; or   10) The thermal conducting structure between neighboring thermal conductors and another thermal conductor can be combined by either immobile or mobile attaching; or   11) The neighboring thermal conductors are in tightly touched combination; or   12) The neighboring thermal conductors are in enclosed combination;
 When the thermal conductor neighboring to a solid state thermal conductor is constituted by gaseous, liquid, colloidal or powder like matters, the thermal energy conducting methods for the thermal conduction coupling surfaces include one or more than one of the following: 
   1) Thermal energy of the neighboring gaseous, liquid, colloidal or powder like matters is transferred through the heat receiving surface of the solid state thermal conductor; or   2) The gaseous, liquid, colloidal or powder like matters at higher temperatures are pumped by liquid pumps or fans to randomly contact with the surface of solid state thermal conductor so as to transfer thermal energy to the neighboring solid state thermal conductor.   
   
   
       13 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein if the first thermal body ( 101 ) or the second thermal body ( 104 ) is a heat source at combustion state, then methods for their thermal conduction to neighboring solid state thermal conducting structures include:
 The thermal energy of neighboring heating body at combustion state is transferred by the heat receiving surface of the solid state thermal conductor   
   
   
       14 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein if the first thermal body ( 101 ) is constituted by gaseous, liquid, colloidal or powder like matters, then its thermal conducting methods include:
 The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters for randomly transfer the thermal energy of the colloidal or powder like matters to the neighboring solid state thermal conductor.   
   
   
       15 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the thermal conducting methods between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) include the following:
 When the second thermal body ( 104 ) is a solid state heat receiving body, and its thermal conduction coupling surface can be combined with the solid state interface thermal conductor ( 103 ) by the one or more than one of the following methods, including:   1) Locking by additional screws and nuts; or   2) Screwing by itself own screw bolt and screw hole; or   3) Riveting; or   4) Pressing; or   5) Clamping; or   6) Adhesion; or   7) Soldering/welding; or   8) Fusion by frictions; or   9) The second thermal body ( 104 ) is combined with the interface thermal conductor ( 103 ) by casting or electroplating; or   10) The thermal conducting structure between the second thermal body ( 104 ) and the interface thermal conductor ( 103 ) can be combined by either immobile or mobile attaching; or   11) The neighboring thermal conductors are in tightly touched combination; or   12) The neighboring thermal conductors are in enclosed combination.   
   
   
       16 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the thermal conducting methods between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) include:
 When the second thermal body ( 104 ) is gaseous, then the methods for thermal conduction coupling with the solid interface thermal conductor ( 103 ) can be constituted by one or more than one methods including:   1) The thermal energy is transferred through the heat receiving surface of solid state interface thermal conductor ( 103 ) to the gaseous second thermal body ( 104 ); or   2) The thermal energy of the gaseous second thermal body ( 104 ) is transferred through the interface thermal conductor ( 103 ) by the fan.   
   
   
       17 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the thermal conducting methods between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) include:—when the second thermal body ( 104 ) is a liquid, the methods for thermal conduction coupling with the interface thermal conductor ( 103 ) can be constituted by one or more than one methods including:
 1) The interface thermal conductor ( 103 ) is soaked in the liquid state second thermal body ( 104 ) for thermal energy transfer by free transfer; or   2) The liquid state second thermal body ( 104 ) is discharged by the pump to pass through the surface of the interface thermal conductor ( 103 ) thereby performing thermal energy transfer with the interface thermal conductor ( 103 ).   
   
   
       18 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the thermal conducting methods between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ) include:
 When the second thermal body ( 104 ) is constituted by colloidal or powder like matters, the methods for thermal conduction coupling with the solid state interface thermal conductor ( 103 ) include:
 The stirring mechanism is driven by manual, electrical or mechanical power to stir the colloidal or powder like matters so as to randomly pass through the interface thermal conductor ( 103 ) for thermal energy transfer. 
   
   
   
       19 . A thermal conduction principle and device of the multi-layers structure with different thermal characteristics as claimed in  claim 2 , wherein the following one or more than one methods can be optionally selected as needed between the first thermal body ( 101 ) and the relay thermal conductor ( 102 ); or between the relay thermal conductor ( 102 ) and the interface thermal conductor ( 103 ); or between the interface thermal conductor ( 103 ) and the second thermal body ( 104 ); or between the relay thermal conductor ( 102 ) and the intermediate thermal conducting layer ( 110 ) when the intermediate thermal conducting layer ( 110 ) is installed; or between the intermediate thermal conducting layer ( 110 ) and the intermediate thermal conducting layer ( 110 ) when multiple intermediate thermal conducting layers ( 110 ) are installed; or between the intermediate thermal conducting layer ( 110 ) and the interface thermal conductor ( 103 ) to assist thermal energy transfer; including:
 1) To be installed with electrically insulated heat conductive piece; or   2) To be coated with thermally conductive grease; or   3) To be installed with electrically insulated thermal conductive piece and coated with thermally conductive grease.