Heat dissipation module

Abstract

The present invention relates a heat dissipation module applied to a microprocessor or light-emitting diodes. The heat dissipation module is provided with at least one heat-conducting column, on at least one end of which an outwardly extending expanded element is provided and on the periphery of which a heat-dissipating element is provided. In such manner, when the heat dissipation module is used for heat dissipation of a microprocessor, the area in contact with a heat source is enlarged by the expanded element, with rapid heat dissipation through the heat-conducting column and the heat-dissipating element. Moreover, when the heat dissipation module is used for light-emitting diodes, the expanded element can increase the heat dissipation area and the number of light-emitting diodes positioned to accelerate heat dissipation.

1 . A heat dissipation module comprising:
 at least one substantially columnar heat-conducting column;   at least one hollow expanded element provided at any end of the heat-conducting column; and   at least one heat-dissipating element fixed on the periphery of the heat-conducting column.   
   
   
       2 . The heat dissipation module as claimed in  claim 1 , wherein the heat-conducting column is a heat pipe. 
   
   
       3 . The heat dissipation module as claimed in  claim 1 , wherein the heat-conducting column is a heat column. 
   
   
       4 . The heat dissipation module as claimed in  claim 1 , wherein the end surface of the expanded element is a planar surface. 
   
   
       5 . The heat dissipation module as claimed in  claim 1 , wherein the end surface of the expanded element is beveled from the outside to the inside. 
   
   
       6 . The heat dissipation module as claimed in  claim 1 , wherein the end surface of the expanded element is beveled from the inside to the outside. 
   
   
       7 . The heat dissipation module as claimed in  claim 1 , wherein the heat-dissipating element is coupled to a collar mounted around the heat-conducting column. 
   
   
       8 . The heat dissipation module as claimed in  claim 1 , wherein the heat-dissipating element is a heat-dissipating block or a heat-dissipating fin. 
   
   
       9 . The heat dissipation module as claimed in  claim 1 , wherein two expanded elements are further provided at the two ends of the heat-conducting column respectively and the heat-dissipating element is disposed between the expanded elements. 
   
   
       10 . The heat dissipation module as claimed in  claim 9 , wherein the heat-dissipating element is in contact with each of the expanded elements. 
   
   
       11 . The heat dissipation module as claimed in  claim 1 , wherein the heat-dissipating element is provided at its end side with a heat-conducting pipe. 
   
   
       12 . The heat dissipation module as claimed in  claim 1 , wherein two heat-conducting columns are provided and correspond to each other, an outwardly extending heat-dissipating element is provided on the outer side of each of the heat-conducting columns, and a connection element is provided between the heat-conducting columns. 
   
   
       13 . The image display method as claimed in  claim 12 , wherein the connection element is made of a thermal conductive material.