Apparatus and method for applying conductive paste onto electronic component

Abstract

An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit. The apparatus and the method allow the conductive paste for forming electrodes to be precisely applied onto the electronic component, easily adjust the amount of the applied conductive paste, prevent the spreading of the conductive paste or the incorrect application of the conductive paste, allow jig units, for applying the conductive paste onto the electronic component, to be used for a long time without replacement or washing, cause the reduction of the maintenance costs of the apparatus, and facilitate the formation of electrodes having various shapes on the electronic component.

1 - 7 . (canceled) 
   
   
       8 . A method for applying a conductive paste onto an electronic component comprising:
 filling paste holes of a first jig unit with the conductive paste;   loading the electronic component onto the first jig unit;   moving extruding pins of a second jig unit, which are inserted into the paste holes of the first jig unit, upward to apply the conductive paste onto the electronic component; and   unloading the electronic component, with the conductive paste applied thereonto, from the first jig unit.   
   
   
       9 . The method according to  claim 8 , wherein the electronic component is loaded onto or unloaded from the first jig unit under the condition that the electronic component is disposed above the upper surface or below the lower surface of the first jig unit in a horizontally laid state, or is disposed by the side of the first jig unit in a vertically erected state. 
   
   
       10 . The method according to  claim 8 , wherein the paste holes of the first jig unit and the extruding pins of the second jig unit have the same shape, and form electrodes having various shapes, each of which is one selected from the group consisting of a circle, a rectangle, a polygon, a star, and a bar, on the electronic component.