US2009307900A1PendingUtilityA1

Method and apparatus for mounting conductive balls

Assignee: SHIBUYA KOGYO CO LTDPriority: Jun 12, 2008Filed: Jun 12, 2008Published: Dec 17, 2009
Est. expiryJun 12, 2028(~1.9 yrs left)· nominal 20-yr term from priority
Inventors:Kazunari Ikeda
B23K 1/20H10W 70/093H05K 2203/082H05K 2203/0557H05K 2203/041Y10T29/49149Y10T29/49144Y10T29/49117Y10T29/53191H05K 3/3478
57
PatentIndex Score
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References
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Claims

Abstract

A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.

Claims

exact text as granted — not AI-modified
1 . A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, the mount comprising mounting positions formed in a predetermined pattern, the arraying mask provided above the mount and comprising through holes provided in positions corresponding to the mounting positions, the method comprising:
 providing a ball suction unit for sucking solder balls, the ball suction unit comprising a ball holding member capable of holding the conductive balls;   sucking up the conductive balls below the ball suction unit;   holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls; and   after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.   
   
   
       2 . The conductive ball mounting method according to  claim 1 ,
 wherein the ball suction unit is connected to switching means for switching ON and OFF sucking the conductive balls by the ball suction unit,   wherein the sucking up the conductive balls and holding the conductive balls are executed when the switching means is switched ON, and   wherein the falling the conductive balls is executed when the switching means is switched OFF.   
   
   
       3 . The conductive ball mounting method according to  claim 2 , further comprising forming a gas flow passage between the ball suction unit and the arraying mask by switching ON the switching means so as to suck the conductive balls by the ball suction unit,
 wherein the sucking up the conductive balls and holding the conductive balls are executed by causing gas to be drawn in from the gas flow passage.   
   
   
       4 . The conductive ball mounting method according to  claim 1 , further comprising repeating the sucking up the conductive balls through the falling the conductive balls a plurality of times. 
   
   
       5 . The conductive ball mounting method according to  claim 2 , further comprising, after the conductive balls are mounted on the mount by the falling the conductive balls, collecting the conductive balls remained on the arraying mask by executing the sucking up and holding the conductive balls. 
   
   
       6 . A conductive ball mounting apparatus comprising:
 a mount including mounting positions formed in a predetermined pattern;   an arraying mask provided above the mount and comprising through holes provided in positions corresponding to the mounting positions;   a ball suction unit provided above the arraying mask for sucking solder balls;   a ball holding member included in the ball suction unit and capable of holding the conductive balls on a lower surface thereof;   a vacuum source connected to the ball suction unit for allowing the ball suction unit to suck the conductive balls; and   switching means for switching ON and OFF sucking the conductive balls by the ball suction unit,   wherein the switching means is configured to:   switch ON the sucking the conductive balls so as to suck up the conductive balls below the ball suction unit and hold the conductive balls on a lower surface of the ball holding member; and   switch OFF the sucking the conductive balls so as to allow the conductive balls held by the ball holding member to fall to the mount.   
   
   
       7 . The conductive ball mounting apparatus according to  claim 6 ,
 wherein the ball suction unit further comprises a casing, and   wherein the ball holding member is provided on a lower surface of the casing.   
   
   
       8 . The conductive ball mounting apparatus according to  claim 7 ,
 wherein the ball suction unit further comprises a ball cup including an interior space and an opening on a lower end face thereof.   
   
   
       9 . The conductive ball mounting apparatus according to  claim 8 ,
 wherein the ball cup is made of a conductive material and is grounded.   
   
   
       10 . The conductive ball mounting apparatus according to  claim 6 ,
 wherein the switching means is configured to repeat ON/OFF the sucking the conductive balls a plurality of times.   
   
   
       11 . The conductive ball mounting apparatus according to  claim 6 ,
 wherein the ball suction unit is configured to move along an upper surface of the arraying mask while the sucking the conductive balls is switched to ON.   
   
   
       12 . The conductive ball mounting apparatus according to  claim 6 , further comprising vibration means for vibrating the ball suction unit. 
   
   
       13 . The conductive ball mounting apparatus according to  claim 6 ,
 wherein the ball holding member comprises a mesh that is configured to allow passage of the gas but not to allow passage of the conductive balls.   
   
   
       14 . The conductive ball mounting apparatus according to  claim 6 , wherein the ball holding member partitions an interior space of the ball suction unit into an upper space and a lower space. 
   
   
       15 . The conductive ball mounting apparatus according to  claim 14 , further comprising a ball supplying path connected to the lower space of the ball suction unit for supplying the conductive balls. 
   
   
       16 . The conductive ball mounting apparatus according to  claim 14 , further comprising a suction passage connecting the upper space of the ball suction unit and the vacuum source.

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