Method for removing micro-debris and device of the same

Abstract

The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes.

1 . A micro-debris removal device for removing micro-debris generated during a machining process performed on a machined object, the machined object being placed on a movable machining platform within a machining range and machined at a machining location, and the micro-debris removal device comprising:
 an acoustic wave generator disposed at the peripheral of the machining range for generating acoustic waves; and   a reflecting part disposed opposite to the acoustic wave generator for reflecting the acoustic waves to produce reflected waves, wherein the acoustic waves and the reflected waves together generates at least two standing waves and two standing wave nodes, the range of the standing waves extending across the machining range for concentrating the micro-debris to the standing wave nodes.   
   
   
       2 . The micro-debris removal device of  claim 1 , wherein the acoustic wave generator comprises an oscillating component and an amplifying component connected with the oscillating component. 
   
   
       3 . The micro-debris removal device of  claim 2 , wherein the amplifying component is disposed opposite to the reflecting part. 
   
   
       4 . The micro-debris removal device of  claim 1 , wherein the reflecting part is either a reflecting wall or a reflecting surface. 
   
   
       5 . The micro-debris removal device of  claim 1 , further comprising a plurality of acoustic wave generators and a plurality of corresponding reflecting parts for generating a plurality of acoustic waves and a plurality of reflected waves. 
   
   
       6 . The micro-debris removal device of  claim 1 , wherein the machining process performed on machined object is a laser machining process performed on the machined object using a laser machine. 
   
   
       7 . The micro-debris removal device of  claim 1 , wherein the standing wave nodes are located outside the machining range. 
   
   
       8 . The micro-debris removal device of  claim 1 , wherein the standing wave nodes are located outside the machined object. 
   
   
       9 . The micro-debris removal device of  claim 1 , wherein the standing wave nodes are located outside the machining location. 
   
   
       10 . A micro-debris removal device for removing micro-debris generated during a machining process performed on a machined object, the machined object being placed on a movable machining platform within a machining range and machined at a machining location, and the micro-debris removal device comprising:
 a first acoustic generator symmetrically disposed at the peripheral of the machining range for generating first acoustic waves; and   a second acoustic generator disposed at the peripheral of the machining range opposite to the first acoustic wave generator for generating second acoustic waves, wherein the first and the second acoustic waves together generates at least two standing waves and two standing wave nodes for concentrating the micro-debris to the standing wave nodes.   
   
   
       11 . The micro-debris removal device of  claim 10 , wherein each of the first and the second acoustic wave generators comprises an oscillating component and an amplifying component connected to the oscillating component. 
   
   
       12 . The micro-debris removal device of  claim 11 , wherein the amplifying components of the first and the second acoustic wave generators are disposed opposite to each other. 
   
   
       13 . The micro-debris removal device of  claim 10 , further comprising a third acoustic wave generator disposed at the peripheral of the machining range and a reflecting part disposed opposite to the third acoustic wave generator for generating acoustic waves and reflected waves, respectively. 
   
   
       14 . The micro-debris removal device of  claim 13 , wherein the reflecting part is either a reflecting wall or a reflecting surface. 
   
   
       15 . The micro-debris removal device of  claim 13 , wherein the machining process performed on machined object is a laser machining process performed on the machined object using a laser machine. 
   
   
       16 . The micro-debris removal device of  claim 10 , wherein the standing wave nodes are located outside the machining range. 
   
   
       17 . The micro-debris removal device of  claim 10 , wherein the standing wave nodes are located outside the machined object. 
   
   
       18 . The micro-debris removal device of  claim 10 , wherein the standing wave nodes are located outside the machining location. 
   
   
       19 . A micro-debris removal method for removing micro-debris generated during a machining process performed on machined object, the machined object being placed on a movable machining platform within a machining range and machined at a machining location, and the micro-debris removal method comprising:
 forming at least two standing waves extending across the machining range and two standing wave nodes;   concentrating the micro-debris to the standing wave nodes by the standing waves; and   removing the micro-debris from the standing wave nodes.   
   
   
       20 . The micro-debris removal method of  claim 19 , further comprising a step of forming acoustic waves and reflected waves within the machining range, which the form the at least two standing waves extending across the machining range and the two standing wave nodes. 
   
   
       21 . The micro-debris removal method of  claim 20 , wherein the locations of the standing wave nodes are determined by adjusting at least one of the frequency and phase of the acoustic waves. 
   
   
       22 . The micro-debris removal method of  claim 19 , further comprising a step of forming first and second acoustic waves within the machining range, which then form the at least two standing waves extending across the machining range and the two standing wave nodes. 
   
   
       23 . The micro-debris removal method of  claim 22 , wherein the locations of the standing wave nodes are determined by adjusting at least one of the frequency and phase of at least one of the first and second acoustic waves. 
   
   
       24 . The micro-debris removal method of  claim 19 , wherein in the step of removing the micro-debris from the standing wave nodes, the micro-debris is removed by means of suction. 
   
   
       25 . The micro-debris removal method of  claim 19 , wherein in the step of removing the micro-debris from the standing wave nodes, the formation of the at least two standing waves extending across the machining range and the two standing wave nodes are stopped, thereby enabling the micro-debris to drop off from the standing wave nodes to outside the machining range. 
   
   
       26 . The micro-debris removal method of  claim 19 , wherein in the machining process performed on machined object, a laser machining is performed on machined object by using a laser machine.