Flexible nozzle for injection molded solder

Abstract

A flexible nozzle for injection molded solder of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

1 . An arrangement for injection molded solder applications, wherein said arrangement comprises:
 a mold having a surface possessing a plurality of recesses; and   a flexible nozzle for extruding solder under pressure into said plurality of recesses during relative movement between said mold and the flexible nozzle upon displacement of the nozzle along the surface of said mold.   
   
   
       2 . An arrangement as claimed in  claim 1 , wherein said flexible nozzle includes a housing having a single reservoir containing said solder; and a plurality of solder discharge apertures in said housing facing said mold surface and communicating with said single reservoir for extruding said solder into said recesses in the mold surface during said relative movement between the components. 
   
   
       3 . An arrangement as claimed in  claim 1 , wherein said flexible nozzle includes a housing having a plurality of separate reservoirs, each containing a quantity of said solder; and a plurality of solder discharge apertures in said housing facing said mold surface of which at least one said aperture communicates with, respectively, one of said reservoirs for extruding the quantities of solder contained therein into said recesses in the mold surface during said relative movement between the components. 
   
   
       4 . An arrangement as claimed in  claim 1 , wherein said mold is of an essentially round or circular configuration, and said mold surface possessing said recesses being substantially planar. 
   
   
       5 . A nozzle wherein the design, materials and structure may be comprised using a high temperature polymer or rubber, a metal coating on a polymer or rubber, a combination of metal, polymer, and/or inorganic material including:
 one or more reservoirs for solder;   one or more dispensing apertures; and   a housing, guide plate or external force to cause the flexible nozzle to alter its shape relative to its position with respect to the mold.