Cooling device with a preformed compliant interface

Abstract

An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit.

1 . An integrated circuit package comprising:
 a substrate;   an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level;   a cooling device located over the electronic circuit, the cooling device comprising a topography of at least one level;   a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit.   
   
   
       2 . The package of  claim 1 , wherein the cooling device comprises a heat sink. 
   
   
       3 . The package of  claim 1 , wherein the compliant interface comprises a first material having high thermal conductivity and a second material comprising compliant properties. 
   
   
       4 . The package of  claim 3  wherein the first and second materials are one material. 
   
   
       5 . The package of  claim 1  wherein the second surface of the compliant interface is in thermal contact with the cooling device and wherein the second surface substantially conforms to the topography of the cooling device. 
   
   
       6 . The package of  claim 1  wherein the cooling device comprises a plurality of fins. 
   
   
       7 . The package of  claim 1  wherein the topography of the electronic circuit is a multi-level topography. 
   
   
       8 . The package of  claim 7  wherein the electronic circuit comprises a plurality of integrated circuits. 
   
   
       9 . The package of  claim 8  wherein the plurality of integrated circuits are of varying heights. 
   
   
       10 . A component comprising:
 a compliant material comprising a first surface wherein the first surface is constructed to match a topography of a printed circuit board in an interlocking manner,   wherein the component is disposed between the printed circuit board and a cooling device.   
   
   
       11 . The component of  claim 10  wherein the topography is a multi-level topography.