US2009286951A1PendingUtilityA1
Low-corrosion epoxy resins and production methods therefor
Est. expiryFeb 28, 2022(expired)· nominal 20-yr term from priority
Inventors:Peter Gröppel
H10W 74/47C08G 59/00
49
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Claims
Abstract
The invention relates to epoxy resins having an extremely low content of chlorine, particularly a low content of organically bound chlorine. The invention also relates to a production method during which total chlorine contents of less than 100 ppm in the epoxy resin are achieved by extracting solid epoxy resin particles, optionally after a prior comminution and/or reprecipitation. The use of these low-chlorine epoxy resins in the fields of electronics and/or electrical engineering considerably reduces the components' susceptibility to corrosion.
Claims
exact text as granted — not AI-modified1 . An epoxy resin having a total chlorine content of less than 100 ppm, said chlorine being present in at least one of an organically and an ionically bound form.
2 . An epoxy resin obtainable by extracting solid epoxy resin in a solvent with a total chlorine content of less than 100 ppm, wherein said chlorine is present in one of an organically and an ionically bound form.
3 . An extracted epoxy resin having a total chlorine content of less than 100 ppm, said chlorine being present in at least one of an organically and an ionically bound form.
4 . A method of using a low-chlorine resin to produce an electronic component with reduced susceptibility to corrosion, comprising the steps of:
providing an electronic component; and combining the electronic component with the epoxy resin according to claim 1 .
5 . A method of using a low-chlorine resin to produce an electronic component with reduced susceptibility to corrosion, comprising the steps of:
providing an electronic component; and combining the electronic component with the epoxy resin according to claim 2 .
6 . A method of using a low-chlorine resin to produce an electronic component with reduced susceptibility to corrosion, comprising the steps of:
providing an electronic component; and combining the electronic component with the extracted epoxy resin according to claim 3 .Join the waitlist — get patent alerts
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