US2009283246A1PendingUtilityA1

Cooling fin structure and heat-dissipating module thereof

Assignee: ASIA VITAL COMPONENTS CO LTDPriority: May 19, 2008Filed: Oct 21, 2008Published: Nov 19, 2009
Est. expiryMay 19, 2028(~1.8 yrs left)· nominal 20-yr term from priority
Inventors:Chih-Ming Chen
H10W 40/226H10W 40/73H10W 40/43F28D 15/0275
47
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Claims

Abstract

A cooling fin structure and a heat-dissipating module thereof are provided. The cooling fin structure includes a plate. The plate extends bilaterally to form a first guiding portion and a second guiding portion with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate. The plate and the first and second guiding portions together define a trough. The cooling fins are stacked up and coupled to a heat pipe, a base, and a fan so as to form a heat-dissipating module. The first guiding portion and the second guiding portion of the cooling fin structure guide a heat-dissipating fluid generated by the fan to the plate and concentrate the fluid so as to enhance heat dissipation greatly.

Claims

exact text as granted — not AI-modified
1 . A cooling fin structure comprising a plate, a first guiding portion, and a second guiding portion, the first and second guiding portions extending from and formed integrally with the plate with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate. 
   
   
       2 . The cooling fin structure of  claim 1 , wherein the first guiding portion angles upwardly relative to the plate, the second guiding portion angles upwardly relative to the plate. 
   
   
       3 . The cooling fin structure of  claim 1 , wherein the first guiding portion and the second guiding portion flank the plate. 
   
   
       4 . The cooling fin structure of  claim 2 , wherein the first guiding portion and the second guiding portion flank the plate. 
   
   
       5 . The cooling fin structure of  claim 1 , wherein the first guiding portion extends to form a first heat-dissipating portion, and the second guiding portion extends to form a second heat-dissipating portion. 
   
   
       6 . The cooling fin structure of  claim 5 , wherein the first and second heat-dissipating portions are formed with at least a through hole. 
   
   
       7 . The cooling fin structure of  claim 1 , wherein the first and second included angles are one of less than 90 degrees, equal to 90 degrees, and greater than 90 degrees. 
   
   
       8 . The cooling fin structure of  claim 1 , wherein the plate and the first and second guiding portions together define a trough. 
   
   
       9 . The cooling fin structure of  claim 2 , wherein the plate and the first and second guiding portions together define a trough. 
   
   
       10 . A heat-dissipating module, comprising:
 a base;   a heat pipe with at least a heat absorption portion and at least a heat transfer portion, the heat absorption portion being connected to the base; and   a cooling fin set comprising a plurality of cooling fins stacked up and penetrated by the heat transfer portion of the heat pipe, the cooling fins each comprising a plate, a first guiding portion, and a second guiding portion, the first and second guiding portions extending from and formed integrally with the plate with a first included angle between the first guiding portion and the plate and a second included angle between the second guiding portion and the plate.   
   
   
       11 . The heat-dissipating module of  claim 10 , wherein the first guiding portion and the second guiding portion angle upwardly relative to the plate, and the first guiding portion and the second guiding portion together define a trough. 
   
   
       12 . The heat-dissipating module of  claim 10 , wherein the first guiding portion extends to form a first heat-dissipating portion, and the second guiding portion extends to form a second heat-dissipating portion. 
   
   
       13 . The heat-dissipating module of  claim 12 , wherein the first and second heat-dissipating portions are formed with at least one of a plurality of through hole, the through holes being oppositely sequentially disposed with the heat transfer portion. 
   
   
       14 . The heat-dissipating module of  claim 10 , wherein the first and second included angles are one of less than 90 degrees, equal to 90 degrees, and greater than 90 degrees. 
   
   
       15 . The heat-dissipating module of  claim 10 , wherein a channel is formed between two adjacent ones of the cooling fins of the cooling fin set. 
   
   
       16 . The heat-dissipating module of  claim 10 , wherein the cooling fin set is coupled to a fan sideward, and the fan faces the plate and the first and second guiding portions.

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