Heat radiation structure of semiconductor device, and manufacturing method thereof

Abstract

The invention of the present application provides a heat radiation structure of a semiconductor device, comprising a substrate having, on a surface thereof, a first area on which the semiconductor device is mounted, and a second area which surrounds the first area, and the semiconductor device which has a first surface and a second surface opposite to the first surface and is formed with a plurality of terminals provided on the first surface, wherein the semiconductor device is mounted on the substrate in such a manner that the first surface is opposite to the surface of the substrate, and wherein a first heat radiating film is formed on the second area of the substrate, and a second heat radiating film is formed on the second surface of the semiconductor device with being spaced away from the first heat radiating film.

1 - 20 . (canceled) 
   
   
       21 . A method of manufacturing a heat radiation structure, comprising the steps of:
 preparing a substrate;   mounting a semiconductor device on the substrate; and   supplying a liquid heat radiating material to thereby form a heat radiating film on the substrate so as to cover an upper surface of the semiconductor device and expose side surfaces thereof.   
   
   
       22 . A method according to  claim 21 , wherein the heat radiating material supplying step has a step for spraying the liquid heat radiating material onto the substrate and the semiconductor device in mist form. 
   
   
       23 . A method according to  claim 21 , wherein the heat radiating film is formed by heating the supplied heat radiating material. 
   
   
       24 . A method according to  claim 21 , wherein the heat radiating material is supplied from above the substrate. 
   
   
       25 . A method according to  claim 21 , wherein the heat radiating material is liquid ceramics. 
   
   
       26 . A method of manufacturing a heat radiation structure, comprising the steps of:
 preparing a substrate;   mounting a semiconductor device on the substrate; and   supplying liquid ceramics to thereby form a heat radiating film on each of the semiconductor device and the substrate exposed from the semiconductor device.   
   
   
       27 - 32 . (canceled)