Cooling configuration for communication boards

Abstract

A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

1 . A cooling configuration for chassis-mounted electronics boards, comprising:
 a housing, said housing having a top, a bottom, a front and a rear and defining a generally enclosed interior space;   a first electronics board having one or more ports and having a first side and a second side;   a second electronics board having one or more ports and having a first side and a second side;   said first and second electronics boards mounted to said housing and one another to define a first air space at said first side of said first electronics board, a second air space between said second side of said first electronics board and said first side of said second electronics board, and a third air space at said second side of said second electronics board;   at least one board air intake in said housing in communication with said first air space, said second air space and said third air space; and   at least one board air exhaust in said housing in communication with said first air space, said second air space and said third air space;   whereby cooling air may flow into said housing through said at least one board air intake, through said first air space, said second air space and said third air space to cool said first and second electronics boards, and out of said housing through said at least one board air exhaust.   
     
     
         2 . The cooling configuration in accordance with  claim 1  wherein said first electronics board is mounted above said second electronics board, said first air space is between said first electronics board and said top of said housing, said second air space is between said first and second electronics boards, and said third air space is between said second electronics board and said bottom of said housing. 
     
     
         3 . The cooling configuration in accordance with  claim 2  wherein said at least one board air intake is located at said front of said housing and said at least one board air exhaust is located at said rear of said housing. 
     
     
         4 . The cooling configuration in accordance with  claim 2  further comprising at least one baffle in said second air space. 
     
     
         5 . The cooling configuration in accordance with  claim 2  further comprising at least one baffle extending from said top of said housing into said first air space towards said first electronics board and at least one baffle extending from said bottom of said housing into said third air space towards said second electronics board. 
     
     
         6 . The cooling configuration in accordance with  claim 1  further comprising at least one air moving device located in said housing and configured to move air through said at least one board air intake to said at least one board air exhaust. 
     
     
         7 . The cooling configuration in accordance with  claim 1  wherein said first and second electronics boards comprise communication boards. 
     
     
         8 . The cooling configuration in accordance with  claim 1  wherein said first and second electronics boards are communicatively coupled. 
     
     
         9 . The cooling configuration in accordance with  claim 1  further comprising at least one power supply, at least one power supply air intake located in said housing and at least one power supply air exhaust located in said housing. 
     
     
         10 . The cooling configuration in accordance with  claim 9  wherein said at least one power supply air intake is located in a side of said housing. 
     
     
         11 . The cooling configuration in accordance with  claim 9  wherein said power supply includes a power supply cooling fan configured to move cooling air from said at least one power supply air intake to said at least one power supply air exhaust. 
     
     
         12 . The cooling configuration in accordance with  claim 19  further comprising at least one baffle located in said housing configured to at least partially segregate air drawn into said housing through said at least one board air intake from air drawn into said at least one power supply air intake. 
     
     
         13 . The cooling configuration in accordance with  claim 1  wherein said housing is configured for mounting to a standard electronics component rack. 
     
     
         14 . The cooling configuration in accordance with  claim 1  wherein said ports of said first and second electronics boards are accessible at said front of said housing and said at least one board cooling air intake is located in said front of said housing between one or more of said ports. 
     
     
         15 . The cooling configuration in accordance with  claim 1  wherein said first electronics board has a front edge located at said front of said housing and said front edge has one or more forward portions and one or more portions set back from said forward portions and from said front of said housing. 
     
     
         16 . The cooling configuration in accordance with  claim 15  wherein said forward portions correspond to locations of said ports of said first electronics board. 
     
     
         17 . The cooling in accordance with  claim 1  wherein said second electronics board has a front edge located at said front of said housing and said front edge has one or more forward portions and one or more portions set back from said forward portions and from said front of said housing. 
     
     
         18 . The cooling configuration in accordance with  claim 17  wherein said forward portions correspond to locations of said ports of said second electronics board. 
     
     
         19 . The cooling configuration in accordance with  claim 1  wherein components are located on said first side of said first electronics board and components are located at said second side of said second electronics board. 
     
     
         20 . The cooling configuration in accordance with  claim 19  wherein said first and second electronics boards are arranged in said housing such that said second side of said first electronics board and said first side of said second electronics board face one another. 
     
     
         21 . A cooling configuration for chassis-mounted electronics boards, comprising:
 a housing, said housing having a top, a bottom, a front and a rear and defining a generally enclosed interior space;   a first electronics board having one or more ports and having a first side and a second side;   a second electronics board having one or more ports and having a first side and a second side;   said first and second electronics boards mounted to said housing and one another to define a first air space at said first side of said first electronics board, a second air space between said second side of said first electronics board and said first side of said second electronics board, and a third air space at said second side of said second electronics board;   at least one board air intake in said housing in communication with said first air space, said second air space and said third air space;   at least one board air exhaust in said housing in communication with said first air space, said second air space and said third air space; and   at least one baffle located in at least one of said first air space, said second air space and third air space;   whereby cooling air may flow into said housing through said at least one board air intake, through said first air space, said second air space and said third air space to cool said first and second electronics boards, and out of said housing through said at least one board air exhaust, as at least partially regulated by said at least one baffle.   
     
     
         22 . The cooling configuration in accordance with  claim 21 wherein at least one baffle is mounted to an interior of a top of said housing and extends into said first air space. 
     
     
         23 . The cooling configuration in accordance with  claim 21  wherein at least one baffle is located in said second air space between said first and second electronics boards. 
     
     
         24 . The cooling configuration in accordance with  claim 21  further comprising at least one power supply located in said housing, wherein at least one baffle is located in said housing and configured to isolate said cooling air flowing through said housing from said at least one board air intake to said at least one board air exhaust. 
     
     
         25 . The cooling configuration in accordance with  claim 21  wherein said at least one baffle has one or more apertures therein controlling a flow of air through said baffle. 
     
     
         26 . The cooling configuration in accordance with  claim 21  wherein said at least one baffle extends towards at least one of said first or second electronics board to direct cooling air towards one or more particular components thereof. 
     
     
         27 . A cooling configuration for chassis-mounted electronics boards, comprising:
 a housing, said housing having a top, a bottom, a front and a rear and defining a generally enclosed interior space;   a plurality of electronics boards each having one or more ports and having a first side and a second side;   said electronics boards located in said housing and mounted so that a cooling air flow space is defined above and below each board, including between boards located adjacent said housing and between boards located adjacent one another;   at least one board air intake in said housing in communication with the cooling air spaces above and below the electronics boards; and   at least one board air exhaust in said housing in communication with said cooling air spaces;   whereby cooling air may flow into said housing through said at least one board air intake, through said cooling air spaces above and below each electronics board, and out of said housing through said at least one board air exhaust.   
     
     
         28 . The cooling configuration in accordance with  claim 27  wherein there is at least a first and a second electronics board. 
     
     
         29 . The cooling configuration in accordance with  claim 27  further comprising at least one baffle positioned between adjacent electronics boards. 
     
     
         30 . The cooling configuration in accordance with  claim 27  wherein adjacent boards are positioned in reverse orientation relative to one another. 
     
     
         31 . The cooling configuration in accordance with  claim 27  wherein said electronics boards are communication boards and at least two of said plurality of boards are connected to one another. 
     
     
         32 . The cooling configuration in accordance with  claim 27  wherein said electronics boards have one or more components and further comprising means for directing air flowing through one or more of said cooling air spaces towards one or more of said components.