US2009279233A1PendingUtilityA1
High volumetric efficiency anodes for electrolytic capacitors
Est. expiryMay 12, 2028(~1.8 yrs left)· nominal 20-yr term from priority
H01G 9/15B22F 7/08B22F 2999/00H01G 9/052
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Claims
Abstract
A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.
Claims
exact text as granted — not AI-modified1 . A capacitor comprising:
an anode lead; an anode with said anode lead extending therefrom wherein said anode comprises an inner region encasing a portion of said anode lead and an outer region encasing at least a portion of said inner region wherein said inner region has a higher density than said outer region; a dielectric on said anode; and a conductor on said dielectric.
2 . The capacitor of claim 1 wherein said anode comprises tantalum.
3 . The capacitor of claim 2 wherein said inner region has a density of at least about 8 g/cm 3 to about 12 g/cm 3 .
4 . The capacitor of claim 2 wherein said outer region has a density of at least about 4 g/cm 3 to 10 g/cm 3 .
5 . The capacitor of claim 2 wherein said density of said outer region and said density of said inner region differ by at least about 1 g/cm 3 .
6 . The capacitor of claim 5 wherein said density of said outer region and said density of said inner region differ by no more than about 8 g/cm 3 .
7 . The capacitor of claim 1 wherein said anode comprises niobium.
8 . The capacitor of claim 7 wherein said inner region has a density of at least about 4 g/cm 3 to about 6 g/cm 3 .
9 . The capacitor of claim 7 wherein said outer region has a density of at least about 2 g/cm 3 to 5 g/cm 3 .
10 . The capacitor of claim 7 wherein said density of said outer region and said density of said inner region differ by at least about 0.5 g/cm 3 .
11 . The capacitor of claim 10 wherein said density of said outer region and said density of said inner region differ by no more than about 4 g/cm 3 .
12 . The capacitor of claim 1 wherein said dielectric is an oxide.
13 . The capacitor of claim 1 wherein said conductor comprises at least one material selected from a metal, manganese dioxide and a conductive polymer.
14 . The capacitor of claim 13 wherein said conductive polymer is selected from the group consisting of polypyrrole, polyaniline and polythiophene.
15 . The capacitor of claim 1 further comprising at least one element selected from an anode termination and a cathode termination.
16 . The capacitor of claim 1 wherein said inner region represents no more than about 33% of said anode volume.
17 . The capacitor of claim 16 wherein said inner region represents no more than about 3.3% of said anode volume.
18 . A process for forming an anode comprising:
a) pressing a powder into a pellet around a lead wire wherein said pellet has a non-uniform density with a higher density region around said lead wire and a lower density region exterior to said higher density region; b) heating said pellet in the presence of Mg to a temperature sufficient to vaporize said Mg and sinter said pellet thereby forming magnesium oxide; and c) removing said magnesium oxide from said pellet.
19 . The process for forming an anode of claim 18 wherein said pressing comprises multi-stage compaction.
20 . The process for forming an anode of claim 18 wherein said pressing comprises compacting said high density region around said wire following by compacting said lower density region around said higher density region.
21 . The process for forming an anode of claim 18 wherein said pressing comprises a process selected from multiple presses in a single die and presses in multiple dies.
22 . The process for forming an anode of claim 18 wherein said powder is tantalum.
23 . The process for forming an anode of claim 22 wherein said higher density region has a density of at least about 8 g/cm 3 to about 12 g/cm 3 .
24 . The process for forming an anode of claim 22 wherein said lower density region has a density of at least about 4 g/cm 3 to about 10 g/cm 3 .
25 . The process for forming an anode of claim 22 wherein density of said lower density region and said density of higher density region differ by at least about 1 g/cm 3 to no more than about 8 g/cm 3 .
26 . The process for forming an anode of claim 18 wherein said powder is niobium.
27 . The process for forming an anode of claim 26 wherein said higher density region has a density of at least about 4 g/cm 3 to about 6 g/cm 3 .
28 . The process for forming an anode of claim 26 wherein said lower density region has a density of at least about 2 g/cm 3 to about 5 g/cm 3 .
29 . The process for forming an anode of claim 26 wherein density of said lower density region and said density of higher density region differ by at least about 0.5 g/cm 3 to no more than about 4 g/cm 3 .
30 . The process for forming an anode of claim 18 wherein said higher density region represents no more than 33% of anode volume.
31 . The process for forming an anode of claim 30 wherein said higher density region represents no more than 3.3% of said anode volume.
32 . The process for forming an anode of claim 18 comprising removing said magnesium oxide by leaching.
33 . The process for forming an anode of claim 32 comprising removing said magnesium oxide by leaching with an aqueous solution comprising H 2 O 2 and H 2 SO 4 .
34 . The process for forming an anode of claim 18 wherein said temperature sufficient to vaporize said Mg and sinter said pellet is at least about 800° C. to no more than about 1,200° C.
35 . The process for forming an anode of claim 18 wherein said heating is in a sealed vessel.
36 . The process for forming an anode of claim 35 wherein said sealed vessel is loaded at ambient pressure.
37 . A process for forming a capacitor comprising:
forming an anode in accordance with claim 18 ; forming a dielectric on said anode; and forming a cathode on said dielectric.
38 . The process for forming a capacitor of claim 37 further comprising:
attaching an anode termination to said lead wire.
39 . The process for forming a capacitor of claim 37 further comprising:
attaching a cathode termination to said cathode.
40 . The process for forming a capacitor of claim 37 further comprising:
encasing at least a portion of said capacitor in a non-conductor.
41 . The process for forming a capacitor of claim 37 wherein said dielectric is an oxide.
42 . The process for forming a capacitor of claim 37 wherein said cathode comprises at least one material selected from a metal, manganese dioxide and a conductive polymer.
43 . The process for forming a capacitor of claim 42 wherein said conductive polymer is selected from the group consisting of polypyrrole, polyaniline and polythiophene.Join the waitlist — get patent alerts
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