Process for fabricating molding stamp

Abstract

A process for fabricating a molding stamp mainly includes the steps of: forming a metal seed film on a substrate; forming a photo resist layer on the metal seed film; exposing the photo resist layer by a direct writing method, and developing the photo resist layer thereby forming a pattern of the photo resist layer, the pattern made of a number of microlens structures and a through hole configured for exposing a portion of the metal seed film therefrom; electroforming a body on the substrate to cover the pattern of the photo resist layer, the body having an extending portion being connected with the metal seed film via the through hole of the photo resist layer; removing the photo resist layer from the substrate; and separating the electroformed body from the substrate.

1 . A process for fabricating a molding stamp, comprising:
 forming a metal seed film on a substrate;   forming a photo resist layer on the metal seed film;   exposing the photo resist layer using a direct writing method,   developing the photo resist layer thereby forming the photo resist layer into a patterned photo resist layer, the patterned photo resist layer comprising a plurality of microlens structures and a through hole exposing a portion of the metal seed film therefrom;   electroforming a metallic body on the substrate to cover the patterned photo resist layer, the metallic body having an extending portion extending through the through hole of the photo resist layer and connected with the exposed portion of the metal seed film;   removing the photo resist layer from the substrate; and   separating the metallic body from the metal seed layer.   
     
     
         2 . The process of  claim 1 , wherein the direct writing method is a direct laser writing method or an electric beam direct writing method. 
     
     
         3 . The process of  claim 1 , further comprising baking the photo resist layer at a temperature in a range from 70 to 100 Celsius degree for a period of time of about 4 to about 8 minutes. 
     
     
         4 . The process of  claim 1 , wherein the metal seed film is comprised of copper, the metallic body is comprised of nickel, 
     
     
         5 . The process of  claim 1 , wherein the metallic body is separated from the metal seed layer by etching. 
     
     
         6 . The process of  claim 1 , wherein both the metal seed film and the metallic body are comprised of nickel. 
     
     
         7 . The process of  claim 1 , wherein the metallic body is separated from the metal seed layer by laser cutting.