Liquid cooling heat dissipating device

Abstract

The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area of surface of the base, and the liquid cooling module is removably installed on the first area of surface of the base. By this way, the users can optionally install the liquid cooling module according to the degrees of the generated heat. Computer suppliers can also reduce the cost effectively.

1 . A liquid cooling heat dissipating device for dissipating heat from a heat source within a chassis of a computer system, said device comprising:
 a base comprising thermally conductive material, wherein said base has an exterior surface with a first area, a second area, and a third area, and wherein said first area is configured to contact with said heat source in a thermally conductive manner;   at least one cooling fin disposed on said second area; and   a liquid cooling module removably attached on said third area.   
   
   
       2 . The liquid cooling heat dissipating device of  claim 1 , further comprising an adapter, and one end of said adapter for combining with the liquid cooling module, and the other end of said adapter for combining with the base, so that the liquid cooling module can be fixed on said third area through the adapter. 
   
   
       3 . The liquid cooling heat dissipating device of  claim 1 , wherein said third area has an accommodating tank, a protrusion or a plurality of protruded posts. 
   
   
       4 . The liquid cooling heat dissipating device of  claim 3 , wherein the inner wall of said accommodating tank has a first thread, and the outer wall of said adapter has a second thread, and said adapter is fixed on the base by locking and joining said first thread and said second thread. 
   
   
       5 . The liquid cooling heat dissipating device of  claim 3 , wherein the outer wall of said protrusion has a first thread, and said adapter has an opening, and at two ends of the inner wall of the opening respectively have a second thread, and said adapter is fixed on the base by locking and joining said first thread and said second thread. 
   
   
       6 . The liquid cooling heat dissipating device of  claim 3 , wherein said protrusion is ring-shaped, and the inner wall of said protrusion has a first thread, the outer wall of said adapter has a second thread, and said adapter is fixed on said base by locking and joining said first thread and said second thread. 
   
   
       7 . The liquid cooling heat dissipating device of  claim 3 , wherein said protruded posts are arranged in a ring-like shape, and one side faced to the inner ring-shaped center of said protruded post has a first thread, the outer wall of said adapter has a second thread, and said adapter is fixed on the base by locking and joining said first thread and said second thread. 
   
   
       8 . The liquid cooling heat dissipating device of  claim 2 , wherein said adapter has an opening, and the inner wall of said opening has a third thread, and one end of said liquid cooling module has a fourth thread, and said liquid cooling module is joined with the adapter by locking and joining said third thread and said fourth thread. 
   
   
       9 . The liquid cooling heat dissipating device of  claim 2 , wherein one end of the adapter has a wedge structure, and one end of the liquid cooling module has a protruded edge, so that said liquid cooling module is joined with the adapter by wedging said protruded edge with said wedge structure. 
   
   
       10 . The liquid cooling heat dissipating device of  claim 1 , wherein the liquid cooling module comprises a body, a liquid entry channel and a liquid exit channel, and the liquid coolant flows into said liquid entry channel and said liquid exit channel to exchange heat with said body. 
   
   
       11 . A liquid cooling heat dissipating device for dissipating heat from a first heat source and a second heat source within a chassis of a computer system, said device comprising:
 a first base comprising thermally conductive material, wherein said first base has an exterior surface with a first area, a second area, and a third area, and wherein said first area is configured to contact with said first heat source in a first thermally conductive manner;   a second base, comprising thermally conductive material, wherein said second base has an exterior surface with a fourth area, a fifth area, and a sixth area, and wherein said fourth area is configured to contact with said second heat source in second thermally conductive manner;   at least one first cooling fin disposed on the second area;   at least one second cooling fin disposed on the fifth area; and   a liquid cooling module removably attached on the third area and the sixth area.   
   
   
       12 . The liquid cooling heat dissipating device of  claim 11 , further comprising two adapters, and two ends of said liquid cooling module respectively fixed on the third area and the sixth area. 
   
   
       13 . The liquid cooling heat dissipating device of  claim 12 , wherein the third area or the sixth area has an accommodating tank, a protrusion or a plurality of protruded posts. 
   
   
       14 . The liquid cooling heat dissipating device of  claim 13 , wherein the inner wall of said accommodating tank has a first thread, and the outer wall of said adapter has a second thread, and said adapter is fixed on said base by locking and joining said first thread and said second thread. 
   
   
       15 . The liquid cooling heat dissipating device of  claim 13 , wherein the outer wall of said protrusion has a first thread, and said adapter has an opening, and two ends of the inner wall of the opening respectively have a second thread and said adapter is fixed on the base by locking and joining said first thread and said second thread. 
   
   
       16 . The liquid cooling heat dissipating device of  claim 13 , wherein said protrusion is ring-shaped, the inner wall of said protrusion has a first thread, and the outer wall of said adapter has a second thread, and said adapter is fixed on said base by locking and joining said first thread and said second thread. 
   
   
       17 . The liquid cooling heat dissipating device of  claim 13 , wherein said protruded post are arranged in a ring-like shape, and one side faced to the inner ring-shaped center of said protruded post has a first thread, the outer wall of said adapter has a second thread, and said adapter is fixed on said base by locking and joining said first thread and said second thread. 
   
   
       18 . The liquid cooling heat dissipating device of  claim 12 , wherein said adapter has an opening, the inner wall of said opening has a third thread, and one end of said liquid cooling module has a fourth thread, and said liquid cooling module is joined with said adapter by locking and joining said third thread and said fourth thread. 
   
   
       19 . The liquid cooling heat dissipating device of  claim 12 , wherein one end of said adapter has a wedge structure, and one end of said liquid cooling module has a protruded edge, so that said liquid cooling module is joined with said adapter by wedging said protruded edge with the wedge structure. 
   
   
       20 . The liquid cooling heat dissipating device of  claim 11 , wherein said liquid cooling module comprises a body, a liquid entry channel and a liquid exit channel, and liquid coolant flows into said liquid entry channel and said liquid exit channel to exchange heat with said body. 
   
   
       21 . A liquid cooling heat dissipating device for dissipating heat from a heat source within a chassis of a computer system, said device comprising:
 a base comprising thermally conductive material, wherein said base has an exterior surface with a first area, a second area, and a third area, and wherein said first area is configured to contact with said heat source in a thermally conductive manner;   at least one cooling fin disposed on said second area; and   means for removably attaching a liquid cooling module to said third area.   
   
   
       22 . The liquid cooling heat dissipating device of  claim 21 , wherein said means comprises an adapter, and one end of said adapter for combining with the liquid cooling module, and the other end of said adapter for combining with the base. 
   
   
       23 . The liquid cooling heat dissipating device of  claim 22 , wherein said third area has an accommodating tank, a protrusion or a plurality of protruded posts. 
   
   
       24 . The liquid cooling heat dissipating device of  claim 23 , wherein the inner wall of said accommodating tank has a first thread, and the outer wall of said adapter has a second thread, and said adapter is fixed on the base by locking and joining said first thread and said second thread. 
   
   
       25 . A method for dissipating heat from a heat source within a chassis of a computer system, said method comprising:
 removably attaching a liquid cooling module to a base comprising thermally conductive material, wherein said base has an exterior surface and at least one cooling fin disposed on a first area of said exterior surface, and wherein a second area of said exterior surface is connected in a thermally conductive manner to a heat source within said chassis; and   flowing liquid coolant into said liquid cooling module to conduct heat from said base.   
   
   
       26 . The method of the  claim 25 , wherein said liquid cooling module is attached to said base by an adapter. 
   
   
       27 . The method of the  claim 26 , wherein said base has an accommodating tank, a protrusion or a plurality of protruded posts on said exterior surface for attaching said adapter. 
   
   
       28 . The method of the  claim 27 , wherein the inner wall of said accommodating tank has a first thread, and the outer wall of said adapter has a second thread, and said adapter is fixed on the base by locking and joining said first thread and said second thread.