Substrate Processing Apparatus and Semiconductor Device Manufacturing Method

Abstract

A substrate processing apparatus comprises a processing chamber for storing a substrate and performing a specified processing on the substrate, a substrate holding jig for holding the substrate in the processing chamber, a placement stand capable of moving the substrate holding jig inside and outside the processing chamber while mounting the substrate holding jig, a substrate holding jig movement mechanism for moving the substrate holding jig to a location different from the placement stand while holding the substrate holding jig, and a substrate holding jig movement suppression mechanism for suppressing vertical and horizontal movement of the substrate holding jig in order to keep the substrate holding jig mounted on the placement unit of the substrate holding jig movement mechanism.

1 . A substrate processing apparatus comprising:
 a processing chamber for storing a substrate and performing a specified processing on the substrate,   a substrate holding jig for holding the substrate in the processing chamber,   a placement stand capable of moving the substrate holding jig inside and outside the processing chamber while mounting the substrate holding jig,   a substrate holding jig movement mechanism for moving the substrate holding jig to a location different from the placement stand while holding the substrate holding jig, and   a substrate holding jig movement suppression mechanism for suppressing vertical and horizontal movement of the substrate holding jig in order to keep the substrate holding jig mounted on the placement unit of the substrate holding jig movement mechanism.   
   
   
       2 . A substrate processing apparatus according to  claim 1 , wherein a lower surface cavity is formed on the lower surface of the substrate holding jig, and a side surface cavity is formed on the side surface of the substrate holding jig, the substrate holding jig movement suppression mechanism includes a placement surface projection disposed at a position facing the lower surface cavity when the substrate holding jig is mounted on the placement surface of the placement unit, and a projection shifter mechanism installed at a position facing the side surface cavity and capable of moving from outside the side surface cavity in and out of the side surface cavity. 
   
   
       3 . A substrate processing apparatus according to  claim 2 , wherein the substrate holding jig movement suppression mechanism further includes multiple substrate holding jig clamps. 
   
   
       4 . A substrate processing apparatus according to  claim 1 , wherein the substrate holding jig movement suppression mechanism is installed to prevent the substrate holding jig from tipping over while the substrate holding jig is mounted in the placement unit. 
   
   
       5 . A substrate processing apparatus according to  claim 1 , further comprising a substrate holding jig anti-tipping mechanism capable of linking and releasing to prevent the substrate holding jig mounted on the placement stand from tipping over, and an anti-tipping control unit to control the linking and releasing of at least the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism. 
   
   
       6 . A substrate processing apparatus according to  claim 5 , wherein the anti-tipping control unit controls the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the placement stand to prevent the substrate holding jig from tipping over. 
   
   
       7 . A substrate processing apparatus according to  claim 1 , further comprising a holding stand positioned at a location different from the placement unit and capable of holding the substrate holding jig, a substrate holding jig anti-tipping mechanism capable of linking and releasing to prevent the substrate holding jig mounted on the holding stand from tipping over, and an anti-tipping control unit to control the linking and releasing of at least the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism. 
   
   
       8 . A substrate processing apparatus according to  claim 7 , wherein the anti-tipping control unit controls the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the holding stand to prevent the substrate holding jig from tipping over. 
   
   
       9 . A semiconductor device manufacturing method for processing by utilizing the substrate processing apparatus according to  claim 1 , and comprising the steps of:
 moving the substrate holding jig into the processing chamber from outside the processing chamber while the substrate holding jig holding the substrate is mounted on the placement stand,   storing the substrate holding jig holding the substrate inside the processing chamber and performing a specified processing,   moving the substrate holding jig holding the substrate from inside the processing chamber to outside the processing chamber while the substrate holding jig is mounted on the placement stand,   moving the substrate holding jig to a location different from the placement stand by the substrate holding jig movement mechanism, and   keeping the substrate holding jig mounted on the placement unit by the substrate holding jig movement suppression mechanism.   
   
   
       10 . A semiconductor device manufacturing method for processing by utilizing the substrate processing apparatus according to  claim 5 , and comprising the steps of:
 moving the substrate holding jig into the processing chamber from outside the processing chamber while the substrate holding jig holding the substrate is mounted on the placement stand,   storing the substrate holding jig holding the substrate inside the processing chamber and performing a specified processing,   moving the substrate holding jig holding the substrate from inside the processing chamber to outside the processing chamber while the substrate holding jig is mounted on the placement stand, and   controlling the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig by the anti-tipping control unit while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the placement stand to prevent the substrate holding jig from tipping over.   
   
   
       11 . A semiconductor device manufacturing method for processing by utilizing the substrate processing apparatus according to  claim 7  and comprising the steps of:
 moving the substrate holding jig into the processing chamber from outside the processing chamber while the substrate holding jig holding the substrate is mounted on the placement stand,   storing the substrate holding jig holding the substrate inside the processing chamber and performing a specified processing,   moving the substrate holding jig holding the substrate from inside the processing chamber to outside the processing chamber while the substrate holding jig is mounted on the placement stand,   moving the substrate holding jig from the placement stand to the holding stand by the substrate holding jig movement mechanism, and   controlling the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig by the anti-tipping control unit while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the holding stand to prevent the substrate holding jig from tipping over.   
   
   
       12 . A semiconductor device manufacturing method comprising the steps of:
 moving a substrate holding jig holding a substrate into a processing chamber from outside the processing chamber while the substrate holding jig is mounted on a placement stand,   storing the substrate holding jig holding the substrate inside the processing chamber and performing a specified processing,   moving the substrate holding jig holding the substrate from inside the processing chamber to outside the processing chamber while the substrate holding jig is mounted on the placement stand,   moving the substrate holding jig to a location different from the placement stand by a substrate holding jig movement mechanism, and   suppressing the horizontal and vertical movement of the substrate holding jig by a substrate holding jig movement suppression mechanism to suppress the vertical and horizontal movement of the substrate holding jig in order to keep the substrate holding jig mounted on the placement unit in the substrate holding jig movement mechanism.   
   
   
       13 . A semiconductor device manufacturing method according to  claim 12  and further comprising:
 a step of controlling the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig by an anti-tipping control unit while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the placement stand to prevent the substrate holding jig from tipping over.   
   
   
       14 . A semiconductor device manufacturing method according to  claim 12  and further comprising:
 a step of controlling the linking of at least one of the substrate holding jig movement suppression mechanism and the substrate holding jig anti-tipping mechanism with the substrate holding jig by an anti-tipping control unit while the substrate holding jig is being transferred between the substrate holding jig movement mechanism and the holding stand to prevent the substrate holding jig from tipping over.