Heat dissipation device

Abstract

A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.

1 . A heat dissipation device adapted for removing heat from a heat-generating electronic device, comprising:
 a base comprising a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader, the base plate defining an opening therein, the heat pipe group having an inserting protrusion which protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate and having a receiving recession which recesses upwardly from a bottom surface of the heat pipe group, and the spreader being received in the receiving recession; and   a first fin unit arranged on a top surface of the base.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the inserting protrusion has a top surface which is coplanar with a top surface of the base plate. 
   
   
       3 . The heat dissipation device as claimed in  claim 1 , wherein the receiving recession is located under the inserting protrusion and in complementary with the inserting protrusion. 
   
   
       4 . The heat dissipation device as claimed in  claim 1 , wherein the heat pipe group consists of a plurality of flexuous heat pipes which have elongated portions arranged side by side to each other to define an evaporating part thereof. 
   
   
       5 . The heat dissipation device as claimed in  claim 4 , wherein the inserting protrusion is formed on a top surface of the evaporating part and opposite to the receiving recession which is formed on a bottom surface of the evaporating part. 
   
   
       6 . The heat dissipation device as claimed in  claim 4 , wherein the heat pipe group further comprises four condensing parts extending outwardly from the evaporating part along corresponding adjacent edges of the base plate to surround the evaporating part. 
   
   
       7 . The heat dissipation device as claimed in  claim 1 , wherein the opening is located in a center of the base plate and has a same rectangular shape as the inserting protrusion, and the base plate has a protecting flange which extends perpendicularly and downwardly from an edge thereof and surrounds the heat pipe group under the base plate. 
   
   
       8 . The heat dissipation device as claimed in  claim 1 , wherein the spreader is received in the receiving recession of the heat pipe group and has a bottom surface projecting downwardly from a bottom surface of the heat pipe group. 
   
   
       9 . The heat dissipation device as claimed in  claim 1 , wherein the first fin unit is fixed to a top surface of the base plate and in a directly contact with a top surface of the inserting protrusion of the heat pipe group. 
   
   
       10 . The heat dissipation device as claimed in  claim 1 , further comprising a second fin unit which is attached to a bottom surface of the heat pipe group at a location beside the spreader. 
   
   
       11 . A heat dissipation device adapted for removing heat from a heat-generating electronic device, comprising:
 a base comprising a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader, the base plate defining therein an opening, the heat pipe group having an inserting protrusion which protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate and having a receiving recession which recesses upwardly from a bottom surface of the heat pipe group, the spreader being received in the receiving recession; and   a first fin unit arranged on a top surface of the base;   wherein the receiving recession is located under the inserting protrusion and in complementary with the inserting protrusion.   
   
   
       12 . The heat dissipation device as claimed in  claim 11 , wherein the inserting protrusion has a top surface which is coplanar with a top surface of the base plate. 
   
   
       13 . The heat dissipation device as claimed in  claim 11 , wherein the heat pipe group consists of a plurality of flexuous heat pipes which have elongated portions arranged side by side to each other to define an evaporating part thereof. 
   
   
       14 . The heat dissipation device as claimed in  claim 13 , wherein the inserting protrusion is formed on a top surface of the evaporating part and opposite to the receiving recession which is formed on a bottom surface of the evaporating part. 
   
   
       15 . The heat dissipation device as claimed in  claim 14 , wherein the heat pipe group further comprises four condensing parts extending outwardly from the evaporating part along corresponding adjacent edges of the base plate to surround the evaporating part. 
   
   
       16 . The heat dissipation device as claimed in  claim 15 , wherein the opening is located in a center of the base plate and a the same rectangular shape as the inserting protrusion, and the base plate has a protecting flange which extends perpendicularly and downwardly from an edge thereof and surrounds the heat pipe group under the base plate. 
   
   
       17 . The heat dissipation device as claimed in  claim 16 , wherein the spreader is received in the receiving recession of the heat pipe group and has a bottom surface projecting downwardly from a bottom surface of the heat pipe group. 
   
   
       18 . The heat dissipation device as claimed in  claim 1 , wherein the first fin unit is fixed to a top surface of the base plate and in a direct contact with a top surface of the inserting protrusion of the heat pipe group. 
   
   
       19 . The heat dissipation device as claimed in  claim 18 , further comprising a second fin unit which is attached to a bottom surface of the heat pipe group at a location beside the spreader.