Heat dissipation device having an improved fin structure

Abstract

A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin.

1 . A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, comprising:
 a base plate adapted for absorbing heat from the heat-generating component;
 a fin unit located above the base plate and having a plurality of fins stacked together, each of the fins having a plurality of parallel and protruding flanges for increasing a heat dissipation area of the each of the fins; and 
 at least a heat pipe having an evaporating section thermally contacting with the base plate and a pair of condensing sections extending through the fins; 
 wherein the protruding flanges of the fins are of equal height and parallel to short sides of the fins, a length of each of the protruding flanges is equal to that of the short sides of the fins, and the protruding flanges located between the condensing sections are spaced from each other with an equal distance. 
   
   
   
       2 . The heat dissipation device of  claim 1 , wherein the flanges located at two flanks of the condensing sections of the at least a heat pipe are spaced from each other with an equal distance. 
   
   
       3 . The heat dissipation device of  claim 2 , wherein the flanges are raised from a top surface of the each of the fins which is parallel to a top surface of the base plate. 
   
   
       4 . The heat dissipation device of  claim 3 , wherein each of the flanges is an elongated strip and perpendicular to the top surface of the each of the fins. 
   
   
       5 . The heat dissipation device of  claim 2 , wherein a plurality of air passages is defined between every two neighboring fins and every two neighboring flanges. 
   
   
       6 . The heat dissipation device of  claim 1 , wherein the condensing sections are perpendicular to the evaporating section, the top surface of the base plate and the fins. 
   
   
       7 . A heat dissipation device, comprising:
 a base plate adapted for absorbing heat from the heat-generating component; and
 a fin unit located over the base plate and having a plurality of fins horizontally stacked together; 
 wherein each of the fins have a plurality of protruding flanges arranged on a surface thereof, the flanges divide a channel between every two neighboring fins into a plurality of parts, and each of the parts forms an elongated air passage. 
   
   
   
       8 . The heat dissipation device of  claim 7 , wherein the flanges are raised from a top surface of the each of the fins which is parallel to a top surface of the base plate. 
   
   
       9 . The heat dissipation device of  claim 8 , wherein each of the flanges is an elongated strip and perpendicular to the top surface of the each of the fins. 
   
   
       10 . The heat dissipation device of  claim 7 , further comprising at least a heat pipe thermally connecting the fin unit and the base plate together. 
   
   
       11 . The heat dissipation device of  claim 10 , wherein the at least a heat pipe has a evaporating section embedded in a top surface of the base plate and two condensing sections extending through the fins. 
   
   
       12 . The heat dissipation device of  claim 11 , wherein the two condensing sections are perpendicular to the evaporating section, the top surface of the base plate and the fins. 
   
   
       13 . A heat dissipation device for dissipating heat generated by an electronic component, comprising:
 a base plate adapted for connecting with the electronic component;   a fin unit thermally connecting with the base plate, wherein the fin unit consists of the a plurality of aluminum-extruded fins stacked on each other, each of the fins has opposite faces and has a plurality of protruding flanges on at least one of the opposite faces, a plurality of air passages being defined between two neighbor fins and the plurality of protruding flanges.   
   
   
       14 . The heat dissipation device of  claim 13  further comprising a heat pipe having an evaporating portion embedded in the base plate and a condensing portion extending through the fins of the fin unit. 
   
   
       15 . The heat dissipation device of  claim 13 , wherein each of the fins is rectangular in shape, and the protruding flanges are parallel to each other and to opposite short sides of the each of the fins. 
   
   
       16 . The heat dissipation device of  claim 14 , wherein each of the fins is rectangular in shape, and the protruding flanges are parallel to each other and to opposite short sides of the each of the fins. 
   
   
       17 . The heat dissipation device of  claim 16 , wherein the protruding flanges are spaced from each other with a same distance, except two neighboring ones of the protruding flanges adjacent to the condensing portion of the heat pipe.