Polishing pad and method for making the same
Abstract
The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved.
Claims
exact text as granted — not AI-modified1 . A polishing pad, comprising:
a base material, formed by covering a fiber layer with a polymer, and having a surface; and a grinding layer, bonded to the surface, and having a plurality of holes.
2 . The polishing pad according to claim 1 , wherein the fiber layer is made of a cloth material.
3 . The polishing pad according to claim 2 , wherein the cloth material is a non-woven cloth.
4 . The polishing pad according to claim 1 , wherein the material of the fiber layer is selected from PP, PET, or nylon.
5 . The polishing pad according to claim 1 , wherein the polymer is continuous foam.
6 . The polishing pad according to claim 5 , wherein the polymer is 15 selected from PU, PP, PET, or polymer resin.
7 . The polishing pad according to claim 1 , wherein the surface is flattened, and the grinding layer is made of one material selected from PU, PP, PET, or polymer resin.
8 . The polishing pad according to claim 1 , wherein the distribution thickness of the holes is at least half of a total thickness of the grinding layer.
9 . The polishing pad according to claim 1 , wherein some fibers in the fiber layer are exposed on the surface, and are further covered by the grinding layer.
10 . The polishing pad according to claim 1 , wherein the compression ratio of the polishing pad is 5% to 50%.
11 . The polishing pad according to claim 1 , wherein the recovery ratio of the polishing pad is greater than 80%.
12 . The polishing pad according to claim 1 , wherein a thickness of the polishing pad is 0.5 to 3.0 mm.
13 . The polishing pad according to claim 1 , wherein the density of the polishing pad is 0.2 to 0.6 g/cm 3 .
14 . A method for making a polishing pad, comprising:
(a) providing a base material, wherein the base material is formed by covering a fiber layer with a polymer and has a surface; (b) forming a liquid-state polymer material on the surface; and (c) solidifying the liquid-state polymer material to form a grinding layer, wherein the grinding layer is bonded to the surface and has a plurality of holes.
15 . The making method according to claim 14 , wherein Step (a) further comprises:
(a1) providing a fiber substrate; (a2) immersing the fiber substrate in a polymer solution, so that the polymer solution covers the fiber substrate; and (a3) solidifying the polymer solution to form the base material.
16 . The making method according to claim 14 , wherein in Step (b), the liquid-state polymer material is formed on the surface by coating.
17 . The making method according to claim 16 , wherein after Step (b), the liquid-state polymer material is solidified to form a flat surface, and the flat surface contacts a liquid-state polymer material in a coagulating tank, so as to form the grinding layer through single surface exchange.
18 . The making method according to claim 14 , wherein in Step (c), the liquid-state polymer material is solidified by natural drying.
19 . The making method according to claim 14 , wherein in Step (c), the liquid-state polymer material is solidified by air drying.Join the waitlist — get patent alerts
Track US2009258578A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.