Polishing compositions and use thereof

Abstract

Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planiarizing surfaces, and preventing delamination and scratches.

1 . A method for planarizing a surface which is formed on a substrate wherein said surface comprises SiO 2  or a low k dielectric which comprises providing on the surface to planarized an aqueous slurry comprising about 0.3 to about 2 percent by weight of abrasive particles; wherein the abrasive particles comprise a member selected from the group consisting of ceria, alumina, silica, titania, zirconia, polymer particles, organic/inorganic composite particles, and combinations thereof, and have a particle size of about 75 to about 300 nanometers; and about 1 to about 3% by weight of solid lubricant particles; wherein the lubricant particles are selected from the group consisting of poly (tetrafluoroethylene), fluoroethylene-propylene copolymers, perfluoroalkoxy resins, polyvinylidene fluoride and mixtures thereof; and have a particle size of 0.05 to about 5 microns; and about 3 to about 6% by weight based upon the amount of the lubricant particles of an anionic or nonionic surfactant;
 and contacting said surface with a polishing pad.   
   
   
       2 . The method of  claim 1  wherein the polishing pad is employed at a speed of rotation of 10-150 rpm and pressure of 2-10 psi. 
   
   
       3 . The method of  claim 1  wherein the polishing pad is a foam polyurethane polishing pad. 
   
   
       4 . The method of  claim 1  wherein the polishing pad is a foam polyurethane polishing pad. 
   
   
       5 . The method of  claim 1  wherein said lubricant particles comprise poly (tetrafluoroethylene).