Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Abstract

A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

1 . (canceled) 
   
   
       2 . A method for manufacturing a wired circuit board and mounting an electronic component thereon, the method comprising the steps of:
 preparing a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°;   forming an insulating layer including a mounting portion on the metal supporting layer;   forming a conductive pattern on the insulating layer;   placing an optical sensor so as to reflect a sensing light at the conductive pattern and inspecting a defective shape of the conductive pattern by the optical sensor;   etching a portion of the metal supporting layer which is overlapping the mounting portion to form an opening such that the insulating layer of the mounting portion exposed by etching has a haze value of 20 to 50%; and   placing an optical sensor to allow transmission of the sensing light through the insulating layer of the mounting portion, aligning the electronic component with the mounting portion by using the optical sensor, and mounting the electronic component on the mounting portion.