Cleaning substrate and cleaning method

Abstract

A cleaning substrate that can prevent a decrease in the operating rate of a substrate processing apparatus. The cleaning substrate that cleans the interior of a chamber in the substrate processing apparatus has a removal mechanism that removes foreign matter in the chamber.

1 . A cleaning substrate that cleans an interior of a processing chamber in a substrate processing apparatus, comprising a removal mechanism that removes foreign matter in the processing chamber. 
     
     
         2 . A cleaning substrate as claimed in  claim 1 , wherein said removal mechanism comprises a particle capturing material that captures particles. 
     
     
         3 . A cleaning substrate as claimed in  claim 1 , wherein said removal mechanism comprises a moisture absorbing material that absorbs moisture. 
     
     
         4 . A cleaning substrate as claimed in  claim 3 , wherein said moisture absorbing material is covered with a waterproofing film. 
     
     
         5 . A cleaning substrate as claimed in  claim 1 , wherein said removal mechanism comprises:
 a bag that entirely covers a cleaning agent that cleans deposit in the processing chamber; and   a base material that supports said bag thereon, and in which a plurality of through holes for transferring pressure of gas supplied into a gap between the cleaning substrate and a mounting stage disposed in the processing chamber when the cleaning substrate is mounted on the mounting stage.   
     
     
         6 . A cleaning substrate as claimed in  claim 1 , wherein said removal mechanism comprises:
 a bag that entirely covers a cleaning agent that cleans deposit in the processing chamber;   a base material that supports said bag thereon; and   a metallic thin film that is provided as a top covering on said bag.   
     
     
         7 . A cleaning substrate as claimed in  claim 1 , wherein said removal mechanism comprises:
 a base material of which surface is coated with a volatile cleaning agent that cleans deposit in the processing chamber; and   a resin film that covers the surface of said base material.   
     
     
         8 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus, comprising:
 a transferring-in step of transferring a cleaning substrate comprising a particle capturing material that captures particles into the processing chamber;   a discharging step of evacuating an interior of the processing chamber to discharge particles in the processing chamber; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.   
     
     
         9 . A cleaning method as claimed in  claim 8 , wherein in said discharging step, scattering of the particles is promoted in the processing chamber. 
     
     
         10 . A cleaning method as claimed in  claim 8 , comprising a removing step of removing particles captured by the particle capturing material of the transferred-out cleaning substrate. 
     
     
         11 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus, comprising:
 a transferring-in step of transferring a cleaning substrate comprising a moisture absorbing material that absorbs moisture into the processing chamber in a state with the cleaning substrate being at a high temperature;   a temperature adjusting step of cooling the transferred-in cleaning substrate and heating the processing chamber; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.   
     
     
         12 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus, comprising:
 a transferring-in step of transferring a cleaning substrate comprising a moisture absorbing material that is covered with a waterproofing film and absorbs moisture into the processing chamber;   an etching step of etching the waterproofing film of the transferred-in cleaning substrate;   a temperature adjusting step of cooling the cleaning substrate and heating the processing chamber; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.   
     
     
         13 . A cleaning method as claimed in  claim 11 , comprising a removing step of removing moisture absorbed by the moisture absorbing material of the transferred-out cleaning substrate. 
     
     
         14 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus that comprises a processing chamber in which a substrate is accommodated, a mounting stage that is disposed in the processing chamber and on which the substrate is mounted, and a plurality of gas supply holes opened to an upper surface of the mounting stage, comprising:
 a mounting step of transferring a cleaning substrate comprising a bag that entirely covers a cleaning agent that cleans deposit in the processing chamber, and a base material that supports the bag thereon, and in which a plurality of through holes are formed into the processing chamber and mounting the cleaning substrate on the mounting stage;   a high-pressure supplying step of supplying gas at high pressure into a gap between the cleaning substrate and the mounting stage; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.   
     
     
         15 . A cleaning method as claimed in  claim 14 , comprising:
 another mounting step of transferring another cleaning substrate comprising a bag that entirely covers a neutralizing agent that neutralizes the cleaning agent, and a base material that supports the bag thereon, and in which a plurality of through holes are formed into the processing chamber and mounting the cleaning substrate on the mounting stage;   another high-pressure supplying step of supplying gas at high pressure into a gap between the cleaning substrate and the mounting stage; and   another transferring-out step of transferring the other cleaning substrate out from the processing chamber.   
     
     
         16 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus that comprises a processing chamber in which a substrate is accommodated, and a mounting stage that is disposed in the processing chamber and on which the substrate is mounted, the mounting stage having therein an electrode plate connected to a DC power source, comprising:
 a mounting step of transferring a cleaning substrate comprising a bag that entirely covers a cleaning agent that cleans deposit in the processing chamber, and a base material that supports the bag thereon, and a metallic thin film that is provided as a top covering on the bag into the processing chamber and mounting the cleaning substrate on the mounting stage;   an applying step of applying a DC voltage to the electrode plate; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.   
     
     
         17 . A method of cleaning an interior of a processing chamber in a substrate processing apparatus, comprising:
 a transferring-in step of transferring a cleaning substrate comprising a base material of which surface is coated with a volatile cleaning agent that cleans deposit in the processing chamber, and a resin film that covers the surface of the base material into the processing chamber;   a producing step of producing plasma in the processing chamber; and   a transferring-out step of transferring the cleaning substrate out from the processing chamber.