Heat exchange device
Abstract
A heat exchange device includes a heat exchanger disposed in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, between which a plurality of thermoelectric elements is connected in series, via an insulating resin layer, which is composed of an epoxy resin or polyimide resin doped with fillers having high thermal conductivity, without intervention of a substrate. The heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining with one of the heat-dissipation electrode and heat-absorption electrode and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, wherein the joint regions and non-joint regions are alternately aligned. Thus, it is possible to achieve high reliability by reducing thermal resistance and thermal stress while increasing the maximum heat absorption coefficient (Qmax).
Claims
exact text as granted — not AI-modified1 . A heat exchange device including a heat exchanger and a thermoelectric module constituted of a plurality of thermoelectric elements which are connected in series and aligned in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, which is coupled with the heat exchanger via an insulating resin layer having high thermal conductivity and an adhesive property, wherein the heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining one of the heat-dissipation electrode and the heat-absorption electrode via the insulating resin layer and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, and wherein the plurality of joint regions and the plurality of non-joint regions are alternately aligned in connection with one of the heat-dissipation electrode and the heat-absorption electrode.
2 . The heat exchange device according to claim 1 , wherein a width of the joint region is larger than a width of the gap formed between the joint regions adjacently aligned in the corrugated fins.
3 . The heat exchange device according to claim 1 , wherein the insulating resin layer is composed of a polyimide resin or an epoxy resin.
4 . The heat exchange device according to claim 1 , wherein the insulating resin layer is doped with a plurality of fillers having high thermal conductivity.
5 . The heat exchange device according to claim 4 , wherein the fillers are composed of any one of an alumina powder, an aluminum nitride powder, and a magnesium oxide powder.
6 . A heat exchange device comprising:
a plurality of heat-dissipation electrodes which are separated from each other and are linearly aligned; a plurality of heat-absorption electrodes which are separated from each other and are linearly aligned; a plurality of thermoelectric elements which are connected in series and aligned between the plurality of heat-dissipation electrodes and the heat-absorption electrodes; and at least one heat exchanger which is disposed in connection with at least one of the heat-dissipation electrodes and the heat-absorption electrodes and which is constituted of a plurality of joint regions joining with one of the heat-dissipation electrodes and the heat-absorption electrodes via a plurality of insulating resin layers and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together.
7 . The heat exchange device according to claim 6 , wherein the plurality of insulating resin layers is composed of a polyimide resin or an epoxy resin, which is doped with a plurality of fillers having high thermal conductivity.Join the waitlist — get patent alerts
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