Heat-dissipating device

Abstract

A heat-dissipating device is used for dissipating heat from a plurality of heat sources. The heat-dissipating device includes a plurality of elongated thermally conductive elements each having an end adapted to thermally contact a respective one of the heat sources, and a fin structure connected to the thermally conductive elements.

1 . A heat-dissipating device for dissipating heat from a plurality of heat sources, said heat-dissipating device comprising:
 a plurality of elongated thermally conductive elements each having an end adapted to thermally contact a respective one of the heat sources; and   a fin structure connected to said thermally conductive elements.   
   
   
       2 . The heat-dissipating device of  claim 1 , wherein each of said thermally conductive elements is solid and rod-shaped. 
   
   
       3 . The heat-dissipating device of  claim 1 , wherein each of said thermally conductive elements is U-shaped. 
   
   
       4 . The heat-dissipating device of  claim 1 , wherein each of said thermally conductive elements is hollow. 
   
   
       5 . The heat-dissipating device of  claim 4 , wherein each of said thermally conductive elements is filled with a working fluid. 
   
   
       6 . The heat-dissipating device of  claim 5 , wherein said working fluid is a liquid coolant. 
   
   
       7 . The heat-dissipating device of  claim 1 , wherein said fin structure includes a plate-shaped fin. 
   
   
       8 . The heat-dissipating device of  claim 1 , wherein said fin structure includes a plurality of spaced-apart plate-shaped fins that are parallel to each other. 
   
   
       9 . The heat-dissipating device of  claim 8 , wherein said thermally conductive elements pass through said fin structure. 
   
   
       10 . The heat-dissipating device of  claim 1 , further comprising a fan disposed in proximity to said fin structure so as to direct air thereonto.