Heat dissipation device

Abstract

A heat dissipation device for dissipating heat generated by an electronic component includes a base, a pair of fin groups and heat pipes connecting the base with the fin groups. The base is used for thermally contacting with the electronic component. The fin groups includes a plurality of fins located over the base. Each of the heat pipes includes an evaporating portion received in the base, a condensing portion extending spirally and upwardly from an end of the evaporating portion through a corresponding fin group. The fins of each fin group is so arranged that each fin group has an arch-shaped profile. The condensing portions in each fin group are parallel to each other. A fan is mounted over the fin groups.

1 . A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, comprising:
 a base;   a fin group comprising a plurality of fins located above and spaced from a top of the base; and   a heat pipe connecting the base with the fin group and comprising an evaporating portion received in the base, a condensing portion extending spirally and upwardly from an end of the evaporating portion through the fin group.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the condensing portion extends spirally along an anti-clockwise direction, and each of the fins of the fin group comprises a bent plate extending upwardly and outwardly from an outward corner thereof to guide airflow into a passage between two neighboring fins. 
   
   
       3 . The heat dissipation device as claimed in  claim 1 , wherein the condensing portion of the heat pipe has a semicircular-shaped configuration, and each of the fins of the fin group is perpendicular to the condensing portion. 
   
   
       4 . The heat dissipation device as claimed in  claim 3  further comprising another heat pipe located opposite to the heat pipe, the another heat pipe comprising an evaporating portion received in the base, and a condensing portion extending spirally and upwardly from an end of the evaporating portion thereof, the condensing portion of the another heat pipe extending through another fin group. 
   
   
       5 . The heat dissipation device as claimed in  claim 4 , wherein the fin group and the another fin group together form an annular configuration. 
   
   
       6 . The heat dissipation device as claimed in  claim 4 , wherein the heat pipe and the another heat pipe comprise two connecting portions located at two opposite sides of the base, respectively, and interconnecting with the evaporating portions and the condensing portions of the heat pipe and the another heat pipe. 
   
   
       7 . The heat dissipation device as claimed in  claim 6 , wherein the fin group and the another fin group each defines a cutout at a lower portion thereof, the cutouts receiving the connecting portions of the heat pipes respectively. 
   
   
       8 . The heat dissipation device as claimed in  claim 1  further comprising a fan holder comprising locking members secured to the base, a plurality of elongated sleeves mounted on the locking members and a pair of arc-shaped supporting plates mounted on tops of the elongated sleeves, a fan being mounted on the arc-shaped supporting plates of the fan holder. 
   
   
       9 . A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, comprising:
 a base adapted for thermally contacting with the electronic component;
 a heat sink assembly located at a top of the base, the heat sink comprises a pair of heat pipes and a plurality of fins extending spirally and upwardly and formed an annular configuration, each of the heat pipes comprising an evaporating portion received in the base, and a condensing portion extending spirally upwardly from an end of the evaporating portion thereof, the condensing portions extending through and supporting the fins thereon; and 
 a fan mounted on a top of the heat sink assembly. 
   
   
   
       10 . The heat dissipation device as claimed in  claim 9 , wherein the fins are spaced from each other and extend spirally along an anti-clockwise direction. 
   
   
       11 . The heat dissipation device as claimed in  claim 9 , wherein each of the fins has a bent plate extending outwardly and upwardly from an outward corner thereof to guide airflow generated by the fan into a passage between two neighboring fins. 
   
   
       12 . The heat dissipation device as claimed in  claim 9 , wherein the heat pipes comprise connecting portions located at opposite sides of the base and received in a cutout defined at a lower portion of each of the fins. 
   
   
       13 . A heat dissipation device comprising:
 a base;   a pair of fins groups each having an arch-shaped profile and mounted over the base;   a fan mounted over the fin groups;   a first heat pipe having an evaporating portion mounted to the base and a condensing portion extending upwardly and spirally from the evaporating portion and through one of the fin groups and;   a second heat pipe having an evaporating portion mounted to the base and a condensing portion extending upwardly and spirally from the evaporating portion of the second heat pipe and through the other of the fin groups;   
   
   
       14 . The heat dissipation device as claimed in  claim 13  further comprising a fan holder including a locking member secured to the base, a sleeve mounted on the locking member, a supporting plate mounted on the sleeve and a screw extending through the supporting plate, the sleeve and the fastening member, the fan being mounted on the supporting plate. 
   
   
       15 . The heat dissipation device as claimed in  claim 13  further comprising a third heat pipe having an evaporating portion mounted to the base and a condensing portion extending upwardly and spirally from the evaporating portion thereof and through the one of the fin groups, the condensing portions of the first and third heat pipes being parallel to each other.