Led package and method of manufacturing the same

Abstract

The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages.

1 . An LED package comprising:
 a base part having a mounting portion to which an LED chip is bonded, and partition wall portions arranged at both sides facing each other of the mounting portion, the mounting portion having the other set of opposite sides opened;   a filling part filling in a space formed by the mounting portion and the partition walls at both opposite sides and transmitting light generated from the LED chip; and   an electrode part molded in the base part, protruding outward, and connected to the LED chip.   
     
     
         2 . The LED package of  claim 1 , wherein the partition walls include a reflective film to reflect light generated from the LED chip. 
     
     
         3 . The LED package of  claim 1 , wherein the base part is a single body. 
     
     
         4 . The LED package of any one of  claims 1 , wherein the base part is provided by dicing a base at predetermined intervals, the base including partition walls formed at both opposite sides, and a groove formed between the partition walls and having a plurality of LED chips bonded thereto. 
     
     
         5 . The LED package of  claim 4 , wherein the filling part is provided by dicing a filler filling in a space formed by the partition walls and the groove of the base, and is exposed through the other set of opposite sides of the mounting portion. 
     
     
         6 . A method of manufacturing an LED package, the method comprising:
 providing a base having partition walls formed at both opposite sides thereof and a groove arranged between the partition walls and having both open ended portions;   arranging a plurality of LED chips at predetermined intervals and bonding the LED chips to the groove;   filling a space formed by the partition walls and the groove with a filler and curing the filler; and   dicing the base filled with the filler at predetermined intervals.   
     
     
         7 . The method of  claim 6 , wherein the filling a space with a filler comprises providing screen members at both open ended portions of the base, and filling a space formed by the partition walls, the groove, and the screen members. 
     
     
         8 . The method of  claim 7 , further comprising removing the screen members before or after the dicing the base. 
     
     
         9 . The method of  claim 6 , wherein in the bonding the LED chips to the groove, the LED chips are arranged at irregular intervals according to the thickness of required LED packages, and
 in the dicing the base, the base is diced to separate the LED chips having thickness varying according to the thickness of the required LED packages.   
     
     
         10 . The method of  claim 6 , wherein the providing a base further comprises forming a reflective film on the partition walls to reflect light generated from the LED chips.