Laser beam processing machine

Abstract

A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).

1 - 4 . (canceled) 
     
     
         5 . A laser beam processing method comprising the steps of,
 holding a silicon wafer on a chuck table,   applying pulse laser beams by a pulse laser beam application means to the silicon wafer held on the chuck table to form a through hole,   moving the chuck table and the pulse laser beam application means relative to each other in a processing-feed direction (X-axis direction) by a processing-feed means,   moving the chuck table and the pulse laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction, and   deflecting the optical axis of the pulse laser beam oscillated by the pulse laser beam oscillation means in the processing-feed direction by a first acousto-optic deflection means (first acousto-optic deflection step),   wherein a plurality of pulse laser beams oscillated by the pulse laser beam oscillation means are applied to a portion of the silicon wafer, in which a through hole is to be formed, while the wafer is moving, by deflection in the processing-feed direction by the first acousto-optic deflection means.   
     
     
         6 . The laser processing method according to  claim 5 , further comprising a second acousto-optic deflection step of deflecting the optical axis of the pulse laser beam oscillated by the pulse laser beam oscillation means in the indexing-feed direction by a second acousto-optic deflection means,
 wherein a plurality of pulse laser beams oscillated by the laser beam oscillation means are applied to a portion of the silicon wafer, in which a through hole is to be formed while the wafer is moving, by deflection in the processing-feed direction by the first acousto-optic deflection means and in the indexing-feed direction by the second acousto-optic deflection means.   
     
     
         7 . The laser processing method according to  claim 5 ,
 wherein a plurality of the through holes are formed on the silicon wafer in the processing-feed direction and a plurality of the pulse laser beams are applied to each portion where each through hole is to be formed to form the through holes in the silicon wafer while the wafer is relatively moving.