Heat-conducting assembly

Abstract

A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.

1 . A heat-conducting assembly, comprising:
 a base;   a first heat-conducting block disposed on the base, the first heat-conducting block having a first slope and a fixing groove;   a second heat-conducting block having a second slope and a locking groove, the second slope being slidingly disposed on the first slope; and   an elastic element having a fixed end and a buckling end formed on one side of the fixed end, the fixed end being fixed into the fixing groove, and the buckling end being buckled in the locking groove.   
   
   
       2 . The heat-conducting assembly according to  claim 1 , wherein the base is attached on a heat-generating element. 
   
   
       3 . The heat-conducting assembly according to  claim 2 , wherein the heat-generating element is a central processor or a chip. 
   
   
       4 . The heat-conducting assembly according to  claim 1 , wherein the base comprises a plurality of through-holes for allowing a positioning piece to pass through. 
   
   
       5 . The heat-conducting assembly according to  claim 1 , wherein the base is formed into an L shape. 
   
   
       6 . The heat-conducting assembly according to  claim 1 , wherein the first heat-conducting block is a trapezoid body. 
   
   
       7 . The heat-conducting assembly according to  claim 1 , wherein the cross section of the fixing groove is formed in U-shaped or circular. 
   
   
       8 . The heat-conducting assembly according to  claim 1 , wherein the second heat-conducting block abuts on a heat-dissipating plate. 
   
   
       9 . The heat-conducting assembly according to  claim 8 , wherein the heat-dissipating plate includes a heat-dissipating fin, a heat pipe or a metallic casing. 
   
   
       10 . The heat-conducting assembly according to  claim 1 , wherein the second heat-conducting block is a trapezoid body. 
   
   
       11 . The heat-conducting assembly according to  claim 1 , wherein a cross section of the locking groove is formed in U-shaped or circular. 
   
   
       12 . The heat-conducting assembly according to  claim 1 , wherein the elastic element is a torsion spring. 
   
   
       13 . A heat-conducting assembly, comprising:
 a base;   a first heat-conducting block disposed on the base, the first heat-conducting block having a first slope and a fixing hole penetrating the first slope;   a second heat-conducting block having a second slope and a restricting groove corresponding to the fixing hole, the second slope being slidingly disposed on the first slope; and   a fixing element penetrating the restricting groove and the fixing hole to be fixed on the first heat-conducting block; and   an elastic body having an abutting end and a compressed end formed on the other end of the abutting end, the abutting end abutting in the restricting groove, and the compressed end being fixed on the fixing element.   
   
   
       14 . The heat-conducting assembly according to  claim 13 , wherein the base is attached on a heat-generating element. 
   
   
       15 . The heat-conducting assembly according to  claim 14 , wherein the heat-generating element is a central processor or a chip. 
   
   
       16 . The heat-conducting assembly according to  claim 13 , wherein the base comprises a plurality of through-holes for allowing a positioning piece to pass through respectively. 
   
   
       17 . The heat-conducting assembly according to  claim 13 , wherein the base is formed into an L shape. 
   
   
       18 . The heat-conducting assembly according to  claim 13 , wherein the first heat-conducting block is a trapezoid body. 
   
   
       19 . The heat-conducting assembly according to  claim 13 , wherein the fixing hole is a screw hole. 
   
   
       20 . The heat-conducting assembly according to  claim 13 , wherein the second heat-conducting block abuts on a heat-dissipating plate. 
   
   
       21 . The heat-conducting assembly according to  claim 20 , wherein the heat-dissipating plate includes a heat-dissipating fin, a heat pipe or a metallic casing. 
   
   
       22 . The heat-conducting assembly according to  claim 13 , wherein the second heat-conducting block is a trapezoid body. 
   
   
       23 . The heat-conducting assembly according to  claim 13 , wherein the restricting groove is an elongate groove. 
   
   
       24 . The heat-conducting assembly according to  claim 13 , wherein the second heat-conducting block further has a through groove, the through groove is provided to correspond to the restricting groove and the fixing hole. 
   
   
       25 . The heat-conducting assembly according to  claim 24 , wherein the through groove is elongate. 
   
   
       26 . The heat-conducting assembly according to  claim 13 , wherein the fixing element is a bolt. 
   
   
       27 . The heat-conducting assembly according to  claim 13 , wherein the elastic body is a compression spring.