US2009229716A1PendingUtilityA1

Copper alloy material for electric/electronic parts and method of producing the same

Assignee: NAKANO JUNSUKEPriority: Oct 10, 2006Filed: Apr 9, 2009Published: Sep 17, 2009
Est. expiryOct 10, 2026(~0.2 yrs left)· nominal 20-yr term from priority
C22F 1/08B21B 3/00C22C 9/06B21B 1/22C22F 1/00H01B 1/02
43
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A copper alloy material for electric/electronic parts, which is produced by the steps containing: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy finish-rolled to a heat treatment under the conditions at a temperature from 500° C. to 800° C. for a time period from 1 second to 100 seconds by means of a continuous annealing line, and strain relief annealing the copper alloy heat-treated under the conditions at a temperature from 400° C. to 600° C. for a time period from 30 seconds to 1000 seconds, wherein the copper alloy material for electric/electronic parts has rates of dimensional changes before and after the strain relief annealing in both directions parallel to and perpendicular to the rolling direction within the range from −0.02% to +0.02%.

Claims

exact text as granted — not AI-modified
1 - 6 . (canceled) 
   
   
       7 . A copper alloy material for electric/electronic parts, which is produced by the steps comprising: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy finish-rolled to a heat treatment under the conditions at a temperature from 500° C. to 800° C. for a time period from 1 second to 100 seconds by means of a continuous annealing line, and strain relief annealing the copper alloy heat-treated under the conditions at a temperature from 400° C. to 600° C. for a time period from 30 seconds to 1000 seconds,
 wherein the copper alloy material for electric/electronic parts has rates of dimensional changes before and after the strain relief annealing in both directions parallel to and perpendicular to the rolling direction within the range from −0.02% to +0.02%.   
   
   
       8 . The copper alloy material for electric/electronic parts according to  claim 7 , wherein the strain relief annealing is conducted in mid course of a material working process for electric/electronic parts. 
   
   
       9 . The copper alloy material for electric/electronic parts according to  claim 7 , wherein the copper alloy material for electric/electronic parts is a lead frame material or a connector material. 
   
   
       10 . The copper alloy material for electric/electronic parts according to  claim 8 , wherein the copper alloy material for electric/electronic parts is a lead frame material or a connector material. 
   
   
       11 . The copper alloy material for electric/electronic parts according to  claim 7 , wherein the copper alloy material for electric/electronic parts comprises Ni from 1.5 mass % to 4.5 mass % and Si from 0.35 mass % to 1.0 mass %, and further comprises at least one or plural elements selected from Mg from 0.05 mass % to 0.15 mass %, Sn from 0.05 mass % to 0.5 mass %, Zn from 0.05 mass % to 1 mass %, Ag from 0.01% to 0.1 mass %, and Cr from 0.05 mass % to 0.4 mass %, with the balance being made of copper and inevitable impurities. 
   
   
       12 . The copper alloy material for electric/electronic parts according to  claim 8 , wherein the copper alloy material for electric/electronic parts comprises Ni from 1.5 mass % to 4.5 mass % and Si from 0.35 mass % to 1.0 mass %, and further comprises at least one or plural elements selected from Mg from 0.05 mass % to 0.15 mass %, Sn from 0.05 mass % to 0.5 mass %, Zn from 0.05 mass % to 1 mass %, Ag from 0.01% to 0.1 mass %, and Cr from 0.05 mass % to 0.4 mass %, with the balance being made of copper and inevitable impurities. 
   
   
       13 . The copper alloy material for electric/electronic parts according to  claim 9 , wherein the copper alloy material for electric/electronic parts comprises Ni from 1.5 mass % to 4.5 mass % and Si from 0.35 mass % to 1.0 mass %, and further comprises at least one or plural elements selected from Mg from 0.05 mass % to 0.15 mass %, Sn from 0.05 mass % to 0.5 mass %, Zn from 0.05 mass % to 1 mass %, Ag from 0.01% to 0.1 mass %, and Cr from 0.05 mass % to 0.4 mass %, with the balance being made of copper and inevitable impurities. 
   
   
       14 . The copper alloy material for electric/electronic parts according to  claim 10 , wherein the copper alloy material for electric/electronic parts comprises Ni from 1.5 mass % to 4.5 mass % and Si from 0.35 mass % to 1.0 mass %, and further comprises at least one or plural elements selected from Mg from 0.05 mass % to 0.15 mass %, Sn from 0.05 mass % to 0.5 mass %, Zn from 0.05 mass % to 1 mass % Ag from 0.01% to 0.1 mass %, and Cr from 0.05 mass % to 0.4 mass %, with the balance being made of copper and inevitable impurities. 
   
   
       15 . A method of producing a copper alloy material for electric/electronic parts, comprising the steps of:
 finish rolling a copper alloy at a reduction ratio of 40% or less;   subjecting the copper alloy finish-rolled to a heat treatment under the conditions at a temperature from 500° C. to 800° C. for a time period from 1 second to 100 seconds by means of a continuous annealing line; and   strain relief annealing the copper alloy heat-treated under the conditions at a temperature from 400° C. to 600° C. for a time period from 30 seconds to 1000 seconds,   to thereby produce the copper alloy material for electric/electronic parts having rates of dimensional changes before and after the strain relief annealing in both directions parallel to and perpendicular to the rolling direction within the range from −0.02% to +0.02%.   
   
   
       16 . The method of producing a copper alloy material for electric/electronic parts according to  claim 15 , wherein the strain relief annealing is conducted in mid course of a material working process for electric/electronic parts.

Join the waitlist — get patent alerts

Track US2009229716A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.