Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop

Abstract

An improved cooling system and method provides isothermal cooling to large arrays of hard disk drives through the use of a pumped refrigerant loop. The present invention relates to cooling electronic components, using a system and method for controlling the cooling of variable heat loads in heat generating devices. This invention allows for the cooling of variable heat loads in electrical, electronic and optical components by pumped two phase loops without the high pumping rates required by single phase pumped loops sized to handle the same loads. Also, when compared to heat pipes, dry out is avoided by using this method which will protect the components from damage due to excess heat.

1 . An improved cooling system comprising:
 at least one hard drive generating heat and required to be cooled;   at least one evaporator surface in thermal contact with the at least one hard drive;   a liquid refrigerant pump;   a vaporizable refrigerant circulated by the liquid refrigerant pump to the at least one evaporator surface, whereby the refrigerant is at least partially evaporated by the heat generated by the at least one hard drive, creating a vapor;   at least one condenser for condensing the vapor, creating a condensed liquid rejecting the heat collected from the at least one hard drive; and   a reservoir for containing the vaporizable refrigerant, whereby liquid exits the at least one condenser and enters the reservoir, allowing the reservoir to supply liquid refrigerant to the liquid refrigerant pump.   
   
   
       2 . An improved cooling system as claimed in  claim 1  further comprising a distribution manifold wherein the liquid refrigerant pump pumps liquid refrigerant to the at least one evaporator surface through the distribution manifold. 
   
   
       3 . An improved cooling system as claimed in  claim 1  further comprising a discharge manifold wherein the liquid refrigerant is collected in the discharge manifold and returned to the at least one condenser. 
   
   
       4 . An improved cooling system as claimed in  claim 1  wherein the condenser comprises an air cooled condenser. 
   
   
       5 . An improved cooling system as claimed in  claim 1  wherein the condenser comprises a liquid cooled condenser. 
   
   
       6 . An improved cooling system as claimed in  claim 1  wherein the condenser comprises an evaporative condenser. 
   
   
       7 . An improved cooling system as claimed in  claim 1  wherein the liquid refrigerant pump comprises a hermetic liquid pump. 
   
   
       8 . An improved cooling system as claimed in  claim 1  wherein the refrigerant comprises R-134a refrigerant. 
   
   
       9 . An improved cooling system as claimed in  claim 1  wherein the at least one evaporator surface comprises copper tubing. 
   
   
       10 . A method for cooling one or more hard disk drive arrays generating heat and required to be cooled, the method comprising the steps of:
 locating at least one evaporator surface in thermal contact with the one or more hard disk drive arrays;   providing a liquid refrigerant pump;   providing a refrigerant;   using the liquid refrigerant pump to circulate refrigerant to the at least one evaporator surface, whereby the refrigerant is at least partially evaporated by the heat generated by the one or more hard disk drive arrays, creating a vapor;   condensing the vapor with at least one condenser to create a condensed liquid; and   providing a reservoir for containing the vaporizable refrigerant, whereby liquid exits the at least one condenser and enters the reservoir, allowing the reservoir to supply liquid refrigerant to the liquid refrigerant pump.   
   
   
       11 . A method as claimed in  claim 10  further comprising the step of providing a distribution manifold wherein the liquid refrigerant pump pumps liquid refrigerant to the at least one evaporator surface through the distribution manifold. 
   
   
       12 . A method as claimed in  claim 10  further comprising the step of providing a discharge manifold wherein the liquid refrigerant is collected in the discharge manifold and returned to the at least one condenser. 
   
   
       13 . A method as claimed in  claim 10  wherein the step of condensing the vapor further comprises the step of providing an air cooled condenser. 
   
   
       14 . A method as claimed in  claim 10  wherein the step of condensing the vapor further comprises the step of providing a liquid cooled condenser. 
   
   
       15 . A method as claimed in  claim 10  wherein the step of condensing the vapor further comprises the step of providing an evaporative condenser. 
   
   
       16 . A method as claimed in  claim 10  wherein the step of providing a liquid refrigerant pump further comprises the step of providing a hermetic liquid pump. 
   
   
       17 . A method as claimed in  claim 10  wherein the step of providing a refrigerant further comprises the step of providing an R-134a refrigerant. 
   
   
       18 . A method as claimed in  claim 10  wherein the step of locating at least one evaporator surface in thermal contact with the one or more hard disk drive arrays further comprises the step of providing at least one copper tubing evaporator surface.