US2009212399A1PendingUtilityA1
Electronic component and method of manufacturing the same
Est. expiryFeb 26, 2028(~1.6 yrs left)· nominal 20-yr term from priority
H03H 3/08H03H 9/1092H03H 9/059
42
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Claims
Abstract
An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
Claims
exact text as granted — not AI-modified1 . An electronic component, comprising:
a substrate; a functional element formed on the substrate; a plurality of terminals each comprising a first terminal electrode connected to the functional element, and a second terminal electrode layered on the first terminal electrode; and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line comprises a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
2 . The electronic component according to claim 1 , wherein the first portion is perpendicular to the edge.
3 . The electronic component according to claim 1 , wherein the second portion proceeds parallel to the edge, and then bends.
4 . The electronic component according to claim 1 , wherein the second terminal electrode is formed by plating.
5 . The electronic component according to claim 1 , wherein the functional element is a surface acoustic wave device comprising an interdigital transducer.
6 . The electronic component according to claim 5 , wherein the interdigital transducer, the first terminal electrode, and the feed line are formed of the same metal layer.
7 . The electronic component according to claim 6 , wherein another metal layer is deposited on the feed line.
8 . An electronic component, comprising:
a substrate; a functional element formed on the substrate; a plurality of terminals each comprising a first terminal electrode connected to the functional element, and a second terminal electrode layered on the first terminal electrode; and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein when hypothetical electronic components having the same structure are arranged on the periphery of the substrate such that a hypothetical wire that extends the feed line across the edge is connected with a hypothetical feed line of the hypothetical electronic components, a restored feed line resulting from connection of the feed line, the hypothetical wire extended portion, and the hypothetical feed line, starts from one of the first terminal electrodes, then traverses on an independent line segment a groove between the edge and the hypothetical electronic component, reaches one of hypothetical first terminal electrodes of the hypothetical electronic component, and thereafter repeatedly on an independent line segment traverses the groove and reaches one of the hypothetical first terminal electrodes or one of the first terminal electrodes, to reach from one end of the groove to the other end.
9 . The electronic component according to claim 8 , wherein the feed line, after starting at the first terminal, returns on the same path and then branches.
10 . A method of manufacturing an electronic component, comprising the steps of:
forming a plurality of first terminal electrodes arranged along both sides of a first intended cutting region in which a substrate is to be cut and provided in a plurality of regions to become electronic components, and a feed line starting from one of the first terminal electrodes, then repeatedly traversing on an independent line segment either the first intended cutting region or a second intended cutting region intersecting the first intended cutting region, reaching one of the first terminal electrodes provided in the region reached by the traversal, to reach from one end of the intended cutting region to the other end; forming, on top of the first electrodes, second terminal electrodes by electroplating, by current supplied from the feed line; and cutting the substrate in the intended cutting regions.
11 . The method of manufacturing an electronic component according to claim 10 , wherein, in the step of forming the feed line, a dicing line is formed by means of a metal layer in the center of the intended cutting regions, and, in the step of cutting the substrate, the dicing line is used as a marker to cut the substrate.
12 . The method of manufacturing an electronic component according to claim 11 , wherein the dicing line is formed along a plurality of the regions without breaks.
13 . The method of manufacturing an electronic component according to claim 11 , wherein a plurality of protrusions are formed along a side face of the dicing line.
14 . The method of manufacturing an electronic component according to claim 10 , wherein the feed line comprises a first portion, connecting a pair of the first terminal electrodes arranged in direct opposition with the first intended cutting region interposed therebetween and traversing the first intended cutting region, and a second portion, branching from the first portion, connecting a pair of the first terminal electrodes arranged diagonally with the first intended cutting region interposed therebetween, and traversing the first intended cutting region.
15 . The method of manufacturing an electronic component according to claim 14 , wherein the first portion is a straight line.
16 . The method of manufacturing an electronic component according to claim 14 , wherein the second portion has a crank shape.Join the waitlist — get patent alerts
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