Dicing die-bonding film

Abstract

The present invention provides a dicing die-bonding film including a dicing film having a pressure sensitive adhesive layer provided on a base material and a die-bonding film provided on the pressure sensitive adhesive layer, and having excellent storage stability of a product even at room temperature. The dicing die-bonding film in the present invention is a dicing die-bonding film having a dicing film including a radiation curable pressure sensitive adhesive layer provided onto a base material and a die-bonding film provided on the pressure sensitive adhesive layer, in which a pressure sensitive adhesive in the pressure sensitive adhesive layer is constituted by containing an acryl polymer, and in which the acid value of the acryl polymer is in a range of 0.01 to 1 and the iodine value is in a range of 5 to 10.

1 . A dicing die-bonding film comprising a dicing film having a radiation curable pressure sensitive adhesive layer provided on a base material and a die-bonding film provided on the pressure sensitive adhesive layer, wherein
 a pressure sensitive adhesive in the pressure sensitive adhesive layer is constituted by containing an acryl polymer, and   the acid value of the acryl polymer is in a range of 0.01 to 1 and the iodine value is in a range of 5 to 10.   
     
     
         2 . The dicing die-bonding film according to  claim 1 , wherein the hydroxyl value of the acryl polymer is in a range of 7 to 30. 
     
     
         3 . The dicing die-bonding film according to  claim 1 , wherein the acryl polymer includes an acryl polymer in which acrylate is used as a main monomer component. 
     
     
         4 . The dicing die-bonding film according to  claim 3 , wherein the acrylate is a monomer exemplified by a chemical formula CH 2 ═CHCOOR (in the formula, R is an alkyl group having 6 to 10 carbon atoms). 
     
     
         5 . The dicing die-bonding film according to  claim 4 , wherein the content of the monomer exemplified by a chemical formula CH 2 ═CHCOOR (in the formula, R is an alkyl group having 6 to 10 carbon atoms) is 50 to 91 mol % based on the entire monomer component. 
     
     
         6 . The dicing die-bonding film according to  claim 5 , wherein the monomer exemplified by a chemical formula CH 2 ═CHCOOR (in the formula, R is an alkyl group having 6 to 10 carbon atoms) is 2-ethylhexylacrylate or isooctylacrylate. 
     
     
         7 . The dicing die-bonding film according to  claim 3 , wherein the acryl polymer contains a hydroxyl group-containing monomer copolymerizable with the acrylate as an essential component. 
     
     
         8 . The dicing die-bonding film according to  claim 7 , wherein the content of the hydroxyl group-containing monomer is in a range of 10 to 30 mol % based on the acrylate. 
     
     
         9 . The dicing die-bonding film according to  claim 1 , wherein the weight average molecular weight of the acryl polymer is 350,000 to 1,000,000 
     
     
         10 . The dicing die-bonding film according to  claim 1 , wherein the tensile elastic modulus of the pressure sensitive adhesive layer at 23° C. before radiation irradiation is in a range of 0.4 to 3.5 MPa, and the tensile elastic modulus at 23° C. after radiation irradiation is in a range of 7 to 100 MPa. 
     
     
         11 . The dicing die-bonding film according to  claim 1 , wherein the pressure sensitive adhesive layer contains a crosslinking agent having two or more functional groups showing reactivity to a hydroxyl group in the molecule. 
     
     
         12 . The dicing die-bonding film according to  claim 11 , wherein the crosslinking agent is at least one type selected from the group consisting of an isocyanate based crosslinking agent, an epoxy based crosslinking agent, an aziridine based crosslinking agent, and a melamine based crosslinking agent. 
     
     
         13 . The dicing die-bonding film according to  claim 1 , wherein the die-bonding film comprises an epoxy resin as a main component. 
     
     
         14 . The dicing die-bonding film according to  claim 1 , further comprising a separator provided on the die-bonding film.