Housing for electronic equipment and manufacturing method thereof

Abstract

The housing for an electronic equipment of the present invention contains a metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated. The preferable embodiments are the one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, the one in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).

1 . A housing for an electronic equipment, comprising:
 a metal housing configured to house an electronic equipment therein; and   a resin film with which the metal housing is coated.   
   
   
       2 . The housing for an electronic equipment according to  claim 1 , wherein the metal housing is formed of a magnesium (Mg) alloy. 
   
   
       3 . The housing for an electronic equipment according to  claim 1 , wherein the resin film comprises a resin layer, and the resin film further comprises an adhesive layer, a print layer, or both the adhesive layer and the print layer between the resin layer and the metal housing. 
   
   
       4 . The housing for an electronic equipment according to  claim 1 , wherein the resin film comprises at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA). 
   
   
       5 . The housing for an electronic equipment according to  claim 3 , wherein the adhesive layer comprises a thermoplastic rubber. 
   
   
       6 . The housing for an electronic equipment according to  claim 5 , wherein the thermoplastic rubber is nitrile rubber or chloroprene rubber. 
   
   
       7 . The housing for an electronic equipment according to  claim 3 , wherein the adhesive layer comprises inorganic filler. 
   
   
       8 . A method for manufacturing a housing for an electronic equipment, comprising:
 heating a resin film so as to soften the resin film;   coating a metal housing with the heated resin film: and   adhering the coated resin film to the metal housing.   
   
   
       9 . The method for manufacturing a housing for an electronic equipment according to  claim 8 , further comprising applying an adhesive to the metal housing. 
   
   
       10 . The method for manufacturing a housing for an electronic equipment according to  claim 9 , further comprising, after the applying the adhesive, heating and drying the adhesive. 
   
   
       11 . The method for manufacturing a housing for an electronic equipment according to  claim 8 , further comprising forming a print layer between a resin layer included in the resin film and the metal housing.