Electronic device carrier tape

Abstract

One aspect provides a carrier tape configured to transport semiconductor packages having a semiconductor package thickness. The carrier tape includes a film having a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thickness. The film is structured to define at least a first structure and a second structure extending between the first and second major surfaces, the first and second structure(s) each having a structure height that is at least equal to the semiconductor package thickness. A hole is punched entirely through the film thickness to define a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height.

1 . A carrier tape configured to transport semiconductor packages having a semiconductor package thickness, the carrier tape comprising:
 a film comprising a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thickness, the film structured to define:
 at least a first structure and a second structure extending between the first and second major surfaces, the first and second structures each having a structure height that is at least equal to the semiconductor package thickness; 
   wherein a hole is punched entirely through the film thickness to define a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height.   
   
   
       2 . The carrier tape of  claim 2 , wherein the film is embossed on both of the first and second major surfaces to define the first and second structures. 
   
   
       3 . The carrier tape of  claim 1 , wherein the film comprises a plurality of pockets formed by a plurality of holes punched entirely through the film thickness, each pocket positioned between one of the first structures and one of the second structures. 
   
   
       4 . The carrier tape of  claim 3 , wherein the film comprises a sealing area adjacent to each of the first and second structures on both of the first and second major surfaces. 
   
   
       5 . The carrier tape of  claim 4 , wherein the film comprises a plurality of troughs, each trough positioned between adjacent pockets and comprising in part the sealing areas on the first and second major surfaces. 
   
   
       6 . The carrier tape of  claim 5 , wherein the trough positioned between adjacent pockets comprises a pitch for semiconductor package spacing. 
   
   
       7 . The carrier tape of  claim 1 , wherein the film comprises a plastic film and the hole punched entirely through the film thickness is characterized by an absence of fibers. 
   
   
       8 . A carrier tape assembly configured to transport semiconductor packages having a semiconductor package thickness, the carrier tape assembly comprising:
 a film comprising a film thickness extending between a first major surface and a second major surface that is less than the semiconductor package thickness, the first and second major surfaces structured to define at least a first structure and a second structure each having a structure height that is at least equal to the semiconductor package thickness, and a hole punched entirely through the film thickness to define a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height;   a first cover sealed to the first major surface to define a well bottom of the pocket; and   a second cover sealed to the second major surface to define a lid for the pocket.   
   
   
       9 . The carrier tape assembly of  claim 8 , wherein the first and second covers are optically transparent. 
   
   
       10 . The carrier tape assembly of  claim 8 , wherein the first structure and a second structure each comprise a first sealing surface and a second sealing surface. 
   
   
       11 . The carrier tape assembly of  claim 8 , wherein the film comprises a plurality of troughs, each trough positioned between adjacent pockets to define a pitch for semiconductor package spacing. 
   
   
       12 . The carrier tape assembly of  claim 8 , wherein the structure height is at least twice the film thickness. 
   
   
       13 . A method of fabricating a carrier tape assembly for transporting semiconductor packages having a semiconductor package thickness, the method comprising:
 structuring a film having a thickness less than the semiconductor package thickness with a pocket having a depth of at least the semiconductor package thickness;   attaching a cover over a first surface of the film and forming a well bottom within the pocket;   placing a semiconductor package in the pocket; and   attaching another cover over a second surface of the film opposite the well bottom of the pocket.   
   
   
       14 . The method of  claim 13 , wherein structuring a film comprises structuring a pocket having a depth of at least twice the film thickness. 
   
   
       15 . The method of  claim 13 , wherein structuring a film comprises forming structures in the film having a height between major surfaces of the film that is at least equal to the semiconductor package thickness. 
   
   
       16 . A method of fabricating a carrier tape assembly for transporting semiconductor packages having a semiconductor package thickness, the method comprising:
 punching a hole entirely through a film having a thickness less than the semiconductor package thickness to form a pocket having a depth of at least the semiconductor package thickness, the hole punched between adjacent structures to define the pocket;   attaching a cover over a first surface of the film and forming a well bottom within the pocket;   placing a semiconductor package in the pocket; and   attaching another cover over a second surface of the film opposite the well bottom of the pocket.   
   
   
       17 . The method of  claim 16 , wherein punching a hole entirely through a film comprises generating fewer than 10,000 particles having a size range of 0.3 micrometers or more. 
   
   
       18 . The method of  claim 16 , wherein punching a hole entirely through a film comprises generating fewer than 3,000 particles having a size range of 0.5 micrometers or more. 
   
   
       19 . The method of  claim 16 , further comprising:
 fabricating a carrier tape having an electrostatic voltage of a magnitude of between 0-5 volts for cycle times of between 0.1-0.7 seconds.   
   
   
       20 . A carrier tape configured to transport semiconductor packages having a semiconductor package thickness, the carrier tape comprising:
 a film comprising a film thickness extending between major surfaces of the film that is less than the semiconductor package thickness;   means for structuring the film to include at least a first structure and a second structure extending between the major surfaces, the first and second structures each having a structure height that is at least equal to the semiconductor package thickness; and   means for defining a pocket positioned between the first and second structures, the pocket having a depth equal to the structure height.   
   
   
       21 . The carrier tape of  claim 20 , wherein means for defining a pocket comprises punching a hole through the major surfaces of the film. 
   
   
       22 . The carrier tape of  claim 20 , further comprising:
 a first cover sealed to a first major surface to define a well bottom of the pocket; and   a second cover sealed to a second major surface to define a lid for the pocket.