Bonding pad for electronic subassemblies

Abstract

A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.

1 . (canceled) 
   
   
       2 . A bonding pad as a gasket for an electronic subassembly, comprising:
 a bonding pad comprising an expandable foam;   an air-tight bladder covering at least one side of the expandable foam;   a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and   an open port.