Gas supply unit and chemical vapor deposition apparatus

Abstract

A gas supply unit and a chemical vapor deposition apparatus are disclosed. A gas supply unit for supplying a reactive gas for a chemical vapor deposition process can include a hot wire part configured to pyrolyze the reactive gas, an ejection part configured to eject the reactive gas towards the hot wire part, and a suction part disposed adjacent to the hot wire part and configured to suck in and exhaust a by-product of the reactive gas. With certain embodiments of the invention, the by-products resulting from the chemical vapor deposition process may be exhausted immediately, so that a thin film may be formed over an object with higher quality, and the cleaning cycles for the inside of the chamber may be extended, for greater productivity.

1 . A gas supply unit for supplying a reactive gas for a chemical vapor deposition process, the gas supply unit comprising:
 a hot wire part configured to pyrolyze the reactive gas;   an ejection part configured to eject the reactive gas towards the hot wire part; and   a suction part disposed adjacent to the hot wire part and configured to suck in and exhaust a by-product of the reactive gas.   
   
   
       2 . The gas supply unit of  claim 1 , wherein the ejection part comprises an ejector, the ejector having a plurality of nozzles formed therein and configured to eject the reactive gas evenly. 
   
   
       3 . An apparatus for depositing a thin film over an object by a chemical vapor deposition process, the apparatus comprising:
 a chamber;   a support part held inside the chamber and supporting the object; and   a gas supply unit attachable to and detachable from an inside of the chamber and positioned facing the object, the gas supply unit configured to supply a reactive gas to the object, and the gas supply unit comprising:
 a hot wire part configured to pyrolyze the reactive gas; 
 an ejection part configured to eject the reactive gas towards the hot wire part; and 
 a suction part disposed adjacent to the hot wire part and configured to suck in and exhaust a by-product of the reactive gas. 
   
   
   
       4 . The apparatus of  claim 3 , wherein the ejection part comprises an ejector, the ejector having a plurality of nozzles formed therein and configured to eject the reactive gas evenly. 
   
   
       5 . The apparatus of  claim 3 , wherein the support part and the gas supply unit are movable in relation to each other. 
   
   
       6 . The apparatus of  claim 3 , wherein the support part comprises a heater, the heater configured to heat the object. 
   
   
       7 . The apparatus of  claim 3 , including a plurality of gas supply units. 
   
   
       8 . The apparatus of  claim 7 , wherein the plurality of gas supply units eject different reactive gases. 
   
   
       9 . The apparatus of  claim 7 , wherein the plurality of gas supply units are arranged in a line, the support part configured to move along the line of gas supply units. 
   
   
       10 . The apparatus of  claim 7 , comprising an annealing unit each disposed adjacent to each of the plurality of gas supply units.