Enhanced Die-Up Ball Grid Array and Method for Making the Same

Abstract

Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a stiffener to the first substrate surface, mounting an IC die to the second stiffener surface, mounting a heat spreader to the IC die, and attaching a plurality of solder balls to the second substrate surface.

1 . A method of assembling a ball grid array (BGA) package, comprising the steps of:
 providing a tape substrate that has a first surface and a second surface;   attaching a first surface of a stiffener to the first substrate surface;   mounting an IC die to the second stiffener surface;   mounting a heat spreader to the IC die; and   attaching a plurality of solder balls to the second substrate surface.   
   
   
       2 . The method of  claim 1 , wherein said heat spreader mounting step comprises the step of:
 causing thermal stress to be reduced at an interface of the IC die and the first stiffener surface during operation of the IC die.   
   
   
       3 . A method of assembling a ball grid array (BGA) package, comprising the steps of:
 providing a substrate that has a first surface and a second surface;   providing at least one opening in a stiffener from a first surface of the stiffener to the second surface of the stiffener;   attaching the first stiffener surface to the first substrate surface;   mounting an integrated circuit (IC) die to the second stiffener surface, wherein a first surface of the IC die includes a contact pad,   coupling the contact pad to the second stiffener surface;   attaching a plurality of solder balls to the second substrate surface, inside an outer dimensional profile of the IC die; and   coupling the plurality of solder balls through corresponding vias in the substrate to the first stiffener surface.   
   
   
       4 . The method of  claim 3 , wherein the substrate includes a metal layer, wherein the metal layer is coupled to a second potential;
 wherein the stiffener has at least one opening extending from the first stiffener surface to the second stiffener surface;   wherein the second IC die surface includes a second contact pad, wherein the method further comprises the step of:   coupling the second contact pad to the metal layer through one of the at least one openings in the stiffener and through a corresponding via that extends through the substrate.   
   
   
       5 . The method of  claim 4 , further comprising the step of:
 coupling the second contact pad to a power potential in the IC die.   
   
   
       6 . The method of  claim 3 , further comprising the step of:
 coupling the contact pad to a ground potential in the IC die.   
   
   
       7 . A method of assembling a ball grid array (BGA) package, comprising the steps of:
 providing a substrate that has a first surface and a second surface;   attaching a first surface of a stiffener to the first substrate surface;   mounting an IC die to the first stiffener surface;   attaching a plurality of solder balls to the second substrate surface; and   attaching a metal ring to the first stiffener surface.   
   
   
       8 . The method of  claim 7  wherein said metal ring attaching step comprises the step of dissipating heat from the stiffener with the metal ring. 
   
   
       9 . A method of assembling a ball grid array (BGA) package, comprising the steps of:
 providing a substrate that has a first surface and a second surface;   creating a wire bond opening along each edge of an IC die mount position on a stiffener, wherein each wire bond opening extends through the stiffener;   attaching a first surface of the stiffener to the first substrate surface;   mounting an IC die to the IC die mount position on a second surface of the stiffener;   bridging at least one of the wire bond openings with at least one stud; and   attaching a plurality of solder balls to the second substrate surface.   
   
   
       10 . The method of  claim 9 , wherein the IC die includes a contact pad, wherein the method further comprises the step of:
 coupling the contact pad to the substrate with a wire bond, wherein the wire bond passes through one of the wire bond openings in the stiffener.   
   
   
       11 . A method of assembling a ball grid array (BGA) package, comprising the steps of:
 providing a substrate that has a first surface and a second surface;   mounting an IC die to the first substrate surface;   attaching a plurality of solder balls to the second substrate surface;   coupling a first surface of a heat spreader to the second substrate surface; and   configuring a second surface of the heat spreader to be coupled to a printed circuit board (PCB).   
   
   
       12 . The method of  claim 11 , further comprising the step of coupling the first substrate surface to the heat spreader through at least one via that extends through the substrate. 
   
   
       13 . The method of  claim 12 , wherein said mounting step comprises the steps of:
 exposing a copper plated die-attach pad to the center of the first substrate surface; and   mounting the IC die to the copper plated die-attach pad.   
   
   
       14 . The method of  claim 12 , wherein said step of coupling the first substrate surface to the heat spreader comprises the steps of:
 exposing a copper plated plane to the center of the second substrate surface; and   coupling the die-attach pad to the copper plated plane with the at least one via.   
   
   
       15 . The method of  claim 11 , wherein said configuring step comprises the step of:
 plating the second surface of the heat spreader with solder.